TY - JOUR
T1 - Correlated material enhanced SRAMs with robust low power operation
AU - Srinivasa, Srivatsa
AU - Aziz, Ahmedullah
AU - Shukla, Nikhil
AU - Li, Xueqing
AU - Sampson, John
AU - Datta, Suman
AU - Kulkarni, Jaydeep P.
AU - Narayanan, Vijaykrishnan
AU - Gupta, Sumeet Kumar
N1 - Publisher Copyright:
© 1963-2012 IEEE.
PY - 2016/12
Y1 - 2016/12
N2 - We propose a novel static random access memory (SRAM) cell employing correlated material (CM) films in conjunction with the transistors to achieve higher read stability, write ability, and energy efficiency. The design of the proposed SRAM cell utilizes orders of magnitude difference in the resistance of the insulating and metallic phases of the CM to mitigate the design conflicts. By appropriately controlling the phase transitions in the CM films during SRAM operation through device-circuit codesign, we achieve 30% higher read static noise margin and 36% increase in the write margin over standard SRAM. The proposed design also leads to a 50% reduction in the leakage current due to high insulating state of the CM. This is achieved at 28% read time penalty. We also discuss the layout implications of our technique and present techniques to sustain no area overhead.
AB - We propose a novel static random access memory (SRAM) cell employing correlated material (CM) films in conjunction with the transistors to achieve higher read stability, write ability, and energy efficiency. The design of the proposed SRAM cell utilizes orders of magnitude difference in the resistance of the insulating and metallic phases of the CM to mitigate the design conflicts. By appropriately controlling the phase transitions in the CM films during SRAM operation through device-circuit codesign, we achieve 30% higher read static noise margin and 36% increase in the write margin over standard SRAM. The proposed design also leads to a 50% reduction in the leakage current due to high insulating state of the CM. This is achieved at 28% read time penalty. We also discuss the layout implications of our technique and present techniques to sustain no area overhead.
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U2 - 10.1109/TED.2016.2621125
DO - 10.1109/TED.2016.2621125
M3 - Article
AN - SCOPUS:85001124972
SN - 0018-9383
VL - 63
SP - 4744
EP - 4752
JO - IEEE Transactions on Electron Devices
JF - IEEE Transactions on Electron Devices
IS - 12
M1 - 7738505
ER -