Corrosion of copper in BTA solutions

Ashraf T. Al-Hinai; Kwadwo Osseo-Asare

doi:10.1149/1.1561278

Corrosion of copper in BTA solutions

Ashraf T. Al-Hinai, Kwadwo Osseo-Asare

Research output: Contribution to journal › Article › peer-review

22 Scopus citations

Abstract

The effect of benzotriazole (BTA) on the open-circuit potential of copper in buffered acid solutions was studied in the absence of the passive Cu(I)BTA film. The film was removed from the surface by in situ continuous scratching of the electrode. At a film-free surface BTA acted mainly as a cathodic inhibitor in contrast to its well-established role as an anodic inhibitor at the film-covered copper surface. The implications for chemical mechanical polishing of copper in BTA-containing slurries are discussed.

Original language	English (US)
Pages (from-to)	B23-B24
Journal	Electrochemical and Solid-State Letters
Volume	6
Issue number	5
DOIs	https://doi.org/10.1149/1.1561278
State	Published - May 2003

All Science Journal Classification (ASJC) codes

General Chemical Engineering
Electrical and Electronic Engineering
General Materials Science
Electrochemistry
Physical and Theoretical Chemistry

Access to Document

10.1149/1.1561278

Cite this

@article{85600d471a14446aad298511605c0df1,

title = "Corrosion of copper in BTA solutions",

abstract = "The effect of benzotriazole (BTA) on the open-circuit potential of copper in buffered acid solutions was studied in the absence of the passive Cu(I)BTA film. The film was removed from the surface by in situ continuous scratching of the electrode. At a film-free surface BTA acted mainly as a cathodic inhibitor in contrast to its well-established role as an anodic inhibitor at the film-covered copper surface. The implications for chemical mechanical polishing of copper in BTA-containing slurries are discussed.",

author = "Al-Hinai, {Ashraf T.} and Kwadwo Osseo-Asare",

year = "2003",

month = may,

doi = "10.1149/1.1561278",

language = "English (US)",

volume = "6",

pages = "B23--B24",

journal = "Electrochemical and Solid-State Letters",

issn = "1099-0062",

publisher = "Electrochemical Society, Inc.",

number = "5",

}

TY - JOUR

T1 - Corrosion of copper in BTA solutions

AU - Al-Hinai, Ashraf T.

AU - Osseo-Asare, Kwadwo

PY - 2003/5

Y1 - 2003/5

N2 - The effect of benzotriazole (BTA) on the open-circuit potential of copper in buffered acid solutions was studied in the absence of the passive Cu(I)BTA film. The film was removed from the surface by in situ continuous scratching of the electrode. At a film-free surface BTA acted mainly as a cathodic inhibitor in contrast to its well-established role as an anodic inhibitor at the film-covered copper surface. The implications for chemical mechanical polishing of copper in BTA-containing slurries are discussed.

AB - The effect of benzotriazole (BTA) on the open-circuit potential of copper in buffered acid solutions was studied in the absence of the passive Cu(I)BTA film. The film was removed from the surface by in situ continuous scratching of the electrode. At a film-free surface BTA acted mainly as a cathodic inhibitor in contrast to its well-established role as an anodic inhibitor at the film-covered copper surface. The implications for chemical mechanical polishing of copper in BTA-containing slurries are discussed.

UR - http://www.scopus.com/inward/record.url?scp=0037652280&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0037652280&partnerID=8YFLogxK

U2 - 10.1149/1.1561278

DO - 10.1149/1.1561278

M3 - Article

AN - SCOPUS:0037652280

SN - 1099-0062

VL - 6

SP - B23-B24

JO - Electrochemical and Solid-State Letters

JF - Electrochemical and Solid-State Letters

IS - 5

ER -

Corrosion of copper in BTA solutions

Abstract

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Fingerprint

Cite this