TY - GEN
T1 - Coupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systems
AU - Xie, Biancun
AU - Swaminathan, Madhavan
AU - Han, Ki Jin
AU - Xie, Jianyong
PY - 2011
Y1 - 2011
N2 - This paper investigates the coupling effect between through-silicon vias (TSVs) in large TSV array structures. A coupling analysis method for large TSV arrays is proposed. Using this method the importance of coupling between TSVs for low resistivity silicon substrates is quantified both in the frequency and time domain. This has been compared with high resistivity silicon substrates. The comparison between the two indicates the importance of jitter and voltage analysis in TSV arrays for low resistivity silicon substrates due to enhanced coupling.
AB - This paper investigates the coupling effect between through-silicon vias (TSVs) in large TSV array structures. A coupling analysis method for large TSV arrays is proposed. Using this method the importance of coupling between TSVs for low resistivity silicon substrates is quantified both in the frequency and time domain. This has been compared with high resistivity silicon substrates. The comparison between the two indicates the importance of jitter and voltage analysis in TSV arrays for low resistivity silicon substrates due to enhanced coupling.
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U2 - 10.1109/ISEMC.2011.6038277
DO - 10.1109/ISEMC.2011.6038277
M3 - Conference contribution
AN - SCOPUS:80054753153
SN - 9781424447831
T3 - IEEE International Symposium on Electromagnetic Compatibility
SP - 16
EP - 21
BT - EMC 2011 - Proceedings
T2 - 2011 IEEE International Symposium on Electromagnetic Compatibility, EMC 2011
Y2 - 14 August 2011 through 19 August 2011
ER -