Coupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systems

Biancun Xie, Madhavan Swaminathan, Ki Jin Han, Jianyong Xie

Research output: Chapter in Book/Report/Conference proceedingConference contribution

34 Scopus citations

Fingerprint

Dive into the research topics of 'Coupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systems'. Together they form a unique fingerprint.

Engineering & Materials Science

Physics & Astronomy