@inproceedings{ad5cbe177c7941efb9e98f981b390bf1,
title = "Crosstalk analysis for varying degree of in-pair coupling in coupled differential pairs",
abstract = "Differentially-routed traces on printed circuit boards typically incorporate loose in-pair coupling when compared to the coupling between the traces and the ground planes. Loose coupling facilitates in-pair skew correction without affecting the differential-mode impedance. However, practical channels combine printed circuit boards with other components that have different degrees of in-pair coupling which could affect the crosstalk among adjacent pairs. This paper examines the effects of different degrees of in-pair coupling on near end crosstalk in the absence of in-pair skew. The analysis will help printed circuit board designers to choose the desired degree of in-pair coupling to achieve targeted near end crosstalk performance.",
author = "Kapil Sharma and Agili, {Sedig S.} and Smith, {Stephen B.}",
year = "2017",
month = apr,
day = "5",
doi = "10.1109/EDAPS.2016.7893135",
language = "English (US)",
series = "2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "95--97",
booktitle = "2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016",
address = "United States",
note = "2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016 ; Conference date: 14-12-2016 Through 16-12-2016",
}