TY - GEN
T1 - Cryogenic Memory Array based on Ferroelectric SQUID and Heater Cryotron
AU - Alam, Shamiul
AU - Islam, Md Mazharul
AU - Hossain, Md Shafayat
AU - Ni, Kai
AU - Narayanan, Vijaykrishnan
AU - Aziz, Ahmedullah
N1 - Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - Cryogenic (cryo) memory devices, designed to operate at/below 4 Kelvin (K) temperature, is a prime enabler of practical quantum computing systems, and superconducting (SC) electronic platforms (Figs. 1(a), (b)) [1]. The state-of-the-art quantum algorithms require many arbitrary rotations which demand a large memory to store program instructions [2]. SC qubits (used in most of the existing quantum computing systems) are highly sensitive to noise and hence, to protect the qubit states from thermal disturbances, they are placed at a few milli-Kelvin (mK) temperature. Furthermore, to preserve the integrity of the quantum states, the SC qubits undergo continuous error correction schemes, requiring extensive memory and bandwidth [2]. Superconducting electronics (SCE) (targeted towards space applications, and high-performance computing) outperforms the conventional CMOS counterparts in terms of speed and energy-efficiency (Fig. 1(c)) [3]. Decades of research efforts have given rise to three major categories (and several sub-variants) of cryo-memories based on SC, non-SC, and hybrid technologies (Fig. 2) [2], [4]-[6]. However, the existing variants suffer from one or more of the following challenges - (i) limited scalability, (ii) process complexity, (iii) bulky peripherals, (iv) array-level interference, (v) volatility, and (vi) speed incompatibility. Therefore, a scalable cryo-memory system remains elusive. To address these existing issues, here, we present a novel cryo-memory system utilizing -(i) the polarization-induced Cooper-pair [7] modulation in a ferroelectric (FE) superconducting quantum interference device (SQUID) (Fig. 3(a)) [8], and (ii) current controlled SC non-SC switching in a heater cryotron (hTron) (Fig. 4) [4]. Discrete prototypes of these devices have been demonstrated recently, but their coupled interactions (which we harness in our work) were never explored before.
AB - Cryogenic (cryo) memory devices, designed to operate at/below 4 Kelvin (K) temperature, is a prime enabler of practical quantum computing systems, and superconducting (SC) electronic platforms (Figs. 1(a), (b)) [1]. The state-of-the-art quantum algorithms require many arbitrary rotations which demand a large memory to store program instructions [2]. SC qubits (used in most of the existing quantum computing systems) are highly sensitive to noise and hence, to protect the qubit states from thermal disturbances, they are placed at a few milli-Kelvin (mK) temperature. Furthermore, to preserve the integrity of the quantum states, the SC qubits undergo continuous error correction schemes, requiring extensive memory and bandwidth [2]. Superconducting electronics (SCE) (targeted towards space applications, and high-performance computing) outperforms the conventional CMOS counterparts in terms of speed and energy-efficiency (Fig. 1(c)) [3]. Decades of research efforts have given rise to three major categories (and several sub-variants) of cryo-memories based on SC, non-SC, and hybrid technologies (Fig. 2) [2], [4]-[6]. However, the existing variants suffer from one or more of the following challenges - (i) limited scalability, (ii) process complexity, (iii) bulky peripherals, (iv) array-level interference, (v) volatility, and (vi) speed incompatibility. Therefore, a scalable cryo-memory system remains elusive. To address these existing issues, here, we present a novel cryo-memory system utilizing -(i) the polarization-induced Cooper-pair [7] modulation in a ferroelectric (FE) superconducting quantum interference device (SQUID) (Fig. 3(a)) [8], and (ii) current controlled SC non-SC switching in a heater cryotron (hTron) (Fig. 4) [4]. Discrete prototypes of these devices have been demonstrated recently, but their coupled interactions (which we harness in our work) were never explored before.
UR - https://www.scopus.com/pages/publications/85137729088
UR - https://www.scopus.com/pages/publications/85137729088#tab=citedBy
U2 - 10.1109/DRC55272.2022.9855813
DO - 10.1109/DRC55272.2022.9855813
M3 - Conference contribution
AN - SCOPUS:85137729088
T3 - Device Research Conference - Conference Digest, DRC
BT - 2022 Device Research Conference, DRC 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2022 Device Research Conference, DRC 2022
Y2 - 26 June 2022 through 29 June 2022
ER -