Cu-compatible ultra-high permittivity dielectrics for embedded passive components

Keyphrases

• Barium Titanate 100%
• Ultra-high 100%
• High Permittivity Dielectrics 100%
• BaTiO3 Film 66%
• Copper Foil 66%
• High-resolution 33%
• Microscopy 33%
• Low Temperature 33%
• Permittivity 33%
• High Temperature 33%
• Annealing 33%
• Coercive Field 33%
• Equiaxed 33%
• Multilayer Ceramic Capacitor 33%
• Chemical Solution Deposition 33%
• Randomly Oriented 33%
• Large Grain 33%
• Ferroelectric Switching 33%
• High-flow Oxygen 33%
• Ferroelectric Transition 33%
• Industry Standards 33%
• Loss Tangent 33%
• High-temperature Sintering 33%
• Interfacial Phase 33%
• Barrier Layer 33%
• Barium Titanate Thin Film 33%
• Switching Field 33%
• Film Processing 33%
• High Capacitance 33%
• Capacitance Density 33%
• Temperature-dependent Measurement 33%
• Chemical Barrier 33%

Engineering

• Thin Films 100%
• Dielectrics 100%
• Barium Titanate 100%
• Passive Component 100%
• Copper Foil 100%
• High Resolution 50%
• Low-Temperature 50%
• Coercive Field 50%
• Industry Standard 50%
• High-Temperature Sintering 50%
• Loss Tangent 50%

Material Science

• Film 100%
• Permittivity 100%
• Thin Films 50%
• Ferroelectric Material 50%
• Barium Titanate 50%
• Density 25%
• Oxidation Reaction 25%
• Capacitor 25%
• Capacitance 25%
• Sintering Temperature 25%
• Solution (Chemistry) 25%
• Film Thickness 25%
• Point Defect 25%