Current-induced degradation of nickel ohmic contacts to SiC

B. P. Downey, J. R. Flemish, B. Z. Liu, T. E. Clark, S. E. Mohney

Research output: Contribution to journalArticlepeer-review

16 Scopus citations


The stability of Ni ohmic contacts to p-type SiC under high current density was investigated. A test structure adapted from the four circular contacts method allowed for vertical stressing and the ability to extract a pre- and post-stressed specific contact resistance. The accuracy of the measured specific contact resistance was verified experimentally through comparisons with more widely used methods and the use of computer modeling. The growth of voids initially produced during the high-temperature ohmic contact anneal was found to be the degradation mechanism, effectively decreasing the area of the contact.

Original languageEnglish (US)
Pages (from-to)563-568
Number of pages6
JournalJournal of Electronic Materials
Issue number4
StatePublished - Apr 2009

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry


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