Cylindrical conduction mode basis functions for modeling of inductive couplings in System-in-Package (SiP)

Ki Jin Han, Ege Engin, Madhavan Swaminathan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

PEEC method with global basis functions on the cylindrical coordinates is presented for efficient modeling of bond wires in System-in-Package. Combination of a few basis functions accurately describes highfrequency effects of closely located wires with shorter simulation time compared to the conventional PEEC method. Simplified equivalent circuit from the proposed method is also favorable for modeling of large coupling structures.

Original languageEnglish (US)
Title of host publicationIEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP
Pages361-364
Number of pages4
DOIs
StatePublished - 2007
EventIEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP - Atlanta, GA, United States
Duration: Oct 29 2007Oct 31 2007

Publication series

NameIEEE Topical Meeting on Electrical Performance of Electronic Packaging

Conference

ConferenceIEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP
Country/TerritoryUnited States
CityAtlanta, GA
Period10/29/0710/31/07

All Science Journal Classification (ASJC) codes

  • General Engineering

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