TY - GEN
T1 - D-band Quasi-Yagi Antenna in Glass-based Package
AU - Erdogan, Serhat
AU - Swaminathan, Madhavan
N1 - Funding Information:
This work was supported in part by ASCENT, one of six centers in JUMP, a Semiconductor Research Corporation (SRC) program sponsored by DARPA. This work was also supported by Georgia Tech Packaging Research Center (GT–PRC) industry consortium for fabrication.
Publisher Copyright:
© 2021 IEEE.
PY - 2021
Y1 - 2021
N2 - This paper presents design, fabrication and measurement results of a printed quasi-Yagi antenna with monopole radiator on glass substrate with low-loss polymer buildup films operating in D-band. Simulated peak gain of the antenna is 6.2 dBi, measured impedance bandwidth \left(\left|S-{11}\right|\lt-10 \mathrm{~dB}\right) covers the entire D-band (110-170 \mathrm{GHz}). Size of the antenna is 0.887 \mathrm{~mm} \times 0.919 \mathrm{~mm}, or 0.413 \lambda-{0} \times 0.429 \lambda-{0} at 140 GHz. Return loss measurements show high repeatability. Wide bandwidth of the antenna, high simulated gain, compact size, and advantages of glass-based packages in terms of supporting high level of integration using Glass Panel Embedding makes it suitable for handset devices for sub-THz wireless communications in D-band.
AB - This paper presents design, fabrication and measurement results of a printed quasi-Yagi antenna with monopole radiator on glass substrate with low-loss polymer buildup films operating in D-band. Simulated peak gain of the antenna is 6.2 dBi, measured impedance bandwidth \left(\left|S-{11}\right|\lt-10 \mathrm{~dB}\right) covers the entire D-band (110-170 \mathrm{GHz}). Size of the antenna is 0.887 \mathrm{~mm} \times 0.919 \mathrm{~mm}, or 0.413 \lambda-{0} \times 0.429 \lambda-{0} at 140 GHz. Return loss measurements show high repeatability. Wide bandwidth of the antenna, high simulated gain, compact size, and advantages of glass-based packages in terms of supporting high level of integration using Glass Panel Embedding makes it suitable for handset devices for sub-THz wireless communications in D-band.
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U2 - 10.1109/IMaRC49196.2021.9714564
DO - 10.1109/IMaRC49196.2021.9714564
M3 - Conference contribution
AN - SCOPUS:85126906081
T3 - 2021 IEEE MTT-S International Microwave and RF Conference, IMARC 2021
BT - 2021 IEEE MTT-S International Microwave and RF Conference, IMARC 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2021 IEEE MTT-S International Microwave and RF Conference, IMARC 2021
Y2 - 17 December 2021 through 19 December 2021
ER -