TY - GEN
T1 - DC IR drop solver for large scale 3D power delivery networks
AU - Xie, Jianyong
AU - Swaminathan, Madhavan
PY - 2010
Y1 - 2010
N2 - In this paper, DC IR drop simulation of 3D power delivery network (PDN) based on finite volume method with non-uniform grid is presented. Location-dependent resistivity is taken into account in the finite volume formulation which enables simulation of power delivery network with inhomogeneous resistivity. The generated system equation b Yx = b is solved using the conjugate gradient (CG) method with a diagonal pre-conditioner. One large scale 3D integration example is simulated, and the results show that by employing the diagonal pre-conditioner and using the symmetric property of the impedance matrix Y, the conjugate gradient method based DC IR drop solver can solve large 3D DC IR drop problem with more than 10 million unknowns with 3 GB memory.
AB - In this paper, DC IR drop simulation of 3D power delivery network (PDN) based on finite volume method with non-uniform grid is presented. Location-dependent resistivity is taken into account in the finite volume formulation which enables simulation of power delivery network with inhomogeneous resistivity. The generated system equation b Yx = b is solved using the conjugate gradient (CG) method with a diagonal pre-conditioner. One large scale 3D integration example is simulated, and the results show that by employing the diagonal pre-conditioner and using the symmetric property of the impedance matrix Y, the conjugate gradient method based DC IR drop solver can solve large 3D DC IR drop problem with more than 10 million unknowns with 3 GB memory.
UR - http://www.scopus.com/inward/record.url?scp=78650954079&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=78650954079&partnerID=8YFLogxK
U2 - 10.1109/EPEPS.2010.5642582
DO - 10.1109/EPEPS.2010.5642582
M3 - Conference contribution
AN - SCOPUS:78650954079
SN - 9781424468652
T3 - 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010
SP - 217
EP - 220
BT - 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010
PB - IEEE Computer Society
ER -