Deep-Ultraviolet Thermoreflectance Thermal Imaging of GaN High Electron Mobility Transistors

Daniel C. Shoemaker, Anwarul Karim, Dustin Kendig, Hyungtak Kim, Sukwon Choi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

Featuring broadband operation and high efficiency, gallium nitride (GaN)-based radio frequency (RF) power amplifiers are key components to realize the next generation mobile network. However, to fully implement GaN high electron mobility transistors (HEMT) for such applications, it is necessary to overcome thermal reliability concerns stemming from localized extreme temperature gradients that form under high voltage and power operation. In this work, we developed a deep-ultraviolet thermoreflectance thermal imaging capability, which can potentially offer the highest spatial resolution among diffraction-limited far-field optical thermography techniques. Experiments were performed to compare device channel temperatures obtained from near-ultraviolet and deep-ultraviolet wavelength illumination sources for the proof of concept of the new characterization method. Deep-ultraviolet thermoreflectance imaging will facilitate the study of device self-heating within transistors based on GaN and emerging ultra-wide bandgap semiconductors (e.g., ß-Ga2O3, AlxGa1-xN, and diamond) subjected to simultaneous extreme electric field and heat flux conditions.

Original languageEnglish (US)
Title of host publicationProceedings of the 21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022
PublisherIEEE Computer Society
ISBN (Electronic)9781665485036
DOIs
StatePublished - 2022
Event21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022 - San Diego, United States
Duration: May 31 2022Jun 3 2022

Publication series

NameInterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
Volume2022-May
ISSN (Print)1936-3958

Conference

Conference21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022
Country/TerritoryUnited States
CitySan Diego
Period5/31/226/3/22

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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