Deformation twinning in polycrystalline copper at room temperature and low strain rate

Chemical Compounds

• Grain Size 71%
• Polycrystalline Solid 68%
• Strain 53%
• Grain Boundary 52%
• Linear Dislocation 46%
• Ambient Reaction Temperature 42%
• Plastic Deformation 31%
• Electron Particle 27%
• Face-Centered Cubic Crystal System 27%
• Shear 23%
• Dimension 19%
• Molecular Dynamics 18%
• Microstructure 17%
• Simulation 16%

Engineering & Materials Science

• Twinning 100%
• Strain rate 70%
• Copper 62%
• Grain boundaries 30%
• Temperature 30%
• Electron microscopes 28%
• Poles 26%
• Equal channel angular pressing 20%
• Shear bands 20%
• Molecular dynamics 17%
• Plastic deformation 13%
• Microstructure 10%
• Computer simulation 8%