Demonstration of strong near-field radiative heat transfer between integrated nanostructures

Raphael St-Gelais, Biswajeet Guha, Linxiao Zhu, Shanhui Fan, Michal Lipson

Research output: Contribution to journalArticlepeer-review

146 Scopus citations


Near-field heat transfer recently attracted growing interest but was demonstrated experimentally only in macroscopic systems. However, several projected applications would be relevant mostly in integrated nanostructures. Here we demonstrate a platform for near-field heat transfer on-chip and show that it can be the dominant thermal transport mechanism between integrated nanostructures, overcoming background substrate conduction and the far-field limit (by factors 8 and 7, respectively). Our approach could enable the development of active thermal control devices such as thermal rectifiers and transistors.

Original languageEnglish (US)
Pages (from-to)6971-6975
Number of pages5
JournalNano letters
Issue number12
StatePublished - Dec 10 2014

All Science Journal Classification (ASJC) codes

  • Bioengineering
  • General Chemistry
  • General Materials Science
  • Condensed Matter Physics
  • Mechanical Engineering


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