In the recent past, fully packaged RF modules suitable for integration in wireless handsets have been fabricated on organic packaging technology that uses a single sheet Liquid Crystalline Polymer (LCP) substrate. This paper demonstrates the RF characterization of inductors that were fabricated on two different stack-ups utilizing different configurations of the LCP substrate. The paper, then, shows the implementations of the embedded LC passives in RF front-end modules such as voltage controlled oscillators (VCOs) and tunable filters. The first application is the design and implementation of a 1.8 GHz feedback oscillator in a novel multi-layer laminate-type process technology that uses three layers of LCP substrate. The microstrip type oscillator measures a phase noise of -117 dBc/Hz at 100 KHz offset at 10 m W of power consumption. The oscillator meets the stringent phase noise specifications of cellular systems for both mobile-station and base-stations. The final application of the high quality factor (Q) passives is in the design and implementation of voltage tunable filters useful for WLAN applications. The filters were fabricated on a completely different stack-up that uses two layers of LCP substrate. The filter prototype is tunable from 1.75 to 2.03 GHz with an insertion loss of 2.5 dB using lossy surface-mount varactor diodes.