Design and Characterization of Metalized Trench Based Waveguide Technology on Glass Interposer for 6G Applications

Xingchen Li, Xiaofan Jia, Serhat Erdogan, Matthew Jordan, Madhavan Swaminathan

Research output: Chapter in Book/Report/Conference proceedingConference contribution


This paper presents the demonstrations of D-band rectangular waveguides, cavity resonators and waveguide filters applying metalized trenches on glass interposer. The metalized trenches perform as side walls for the fully integrated waveguide structures. The proposed trench is created by laser drilling on the polymer dielectric and metalized through copper plating, which is compatible with the semi-additive patterning (SAP) process for glass interposer fabrication. Supported by the trenches, the designed waveguide shows a loss of 0.31 - 0.42 dB/mm over the D-band, the designed resonator has a loaded Q-factor of 86.13 at 140 GHz, and the designed filter performs an insertion loss of 1.75 dB at 140 GHz with 7.5 GHz 3-dB bandwidth.

Original languageEnglish (US)
Title of host publication2023 IEEE/MTT-S International Microwave Symposium, IMS 2023
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages4
ISBN (Electronic)9798350347647
StatePublished - 2023
Event2023 IEEE/MTT-S International Microwave Symposium, IMS 2023 - San Diego, United States
Duration: Jun 11 2023Jun 16 2023

Publication series

NameIEEE MTT-S International Microwave Symposium Digest
ISSN (Print)0149-645X


Conference2023 IEEE/MTT-S International Microwave Symposium, IMS 2023
Country/TerritoryUnited States
CitySan Diego

All Science Journal Classification (ASJC) codes

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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