Design and demonstration of low cost, panel-based polycrystalline silicon interposer with through-package-vias (TPVs)

Qiao Chen, Tapobrata Bandyopadhyay, Yuya Suzuki, Fuhan Liu, Venky Sundaram, Raghuram Pucha, Madhavan Swaminathan, Rao Tummala

Research output: Chapter in Book/Report/Conference proceedingConference contribution

24 Scopus citations

Abstract

This paper for the first time proposes and demonstrates the use of panel-based polycrystalline silicon interposers for highest I/Os at lowest cost. Such an interposer is targeted at roughly a 10 lower cost compared to wafer based silicon interposers with through silicon vias (TSVs) and back end of line (BEOL) re-distribution layers (RDL). Laser via ablation was used to demonstrate through package vias (TPVs) as small as 10m diameter in 220m thin polycrystalline silicon panels made without any chemical-mechanical polishing (CMP). A thick polymer via liner and stress buffer layer was formed in the silicon TPVs to replace oxide liners and diffusion barriers used in TSVs. A panel silicon interposer test vehicle process demonstrator was fabricated and initial electrical measurements indicate much lower loss compared to CMOS silicon interposer with thin oxide liners. Electrical and mechanical design and modeling was also carried out to provide design guidelines for TPV formation.

Original languageEnglish (US)
Title of host publication2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011
Pages855-860
Number of pages6
DOIs
StatePublished - 2011
Event2011 61st Electronic Components and Technology Conference, ECTC 2011 - Lake Buena Vista, FL, United States
Duration: May 31 2011Jun 3 2011

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Conference

Conference2011 61st Electronic Components and Technology Conference, ECTC 2011
Country/TerritoryUnited States
CityLake Buena Vista, FL
Period5/31/116/3/11

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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