TY - GEN
T1 - Design and fabrication of integrated RF modules in Liquid Crystalline Polymer (LCP) substrates
AU - Swaminathan, M.
AU - Bavisi, A.
AU - Yun, W.
AU - Sundaram, V.
AU - Govind, V.
AU - Monajemi, P.
PY - 2005
Y1 - 2005
N2 - This paper presents the design and fabrication of fully-packaged RF modules that are suitable for integration in portable handset applications. The system blocks utilize high Q passive devices that are embedded in Liquid Crystalline Polymer (LCP) based substrates. Firstly, the paper introduces the packaging technology that utilizes multiple sheets of LCP substrate. Characterization of high Q inductors on the multi-layer process is then demonstrated showing scalability of inductor size and Q from 900 MHz to 10 GHz. Finally, the paper presents the results of the following key LCP based RF modules: voltage controlled oscillators, concurrent dual-band oscillators, mixers, filters, and baluns. A comparison with the current state-of-the-art is made. The paper shows that the implemented system modules are smaller in size, with superior electrical performance to currently available discrete solutions. The paper shows that the proposed technology supports high-density integration at low cost and hence, is suitable for large volume commercial wireless handheld applications. Finally, a MEMS process to be integrated on the proposed LCP technology for tunability of the modules is presented.
AB - This paper presents the design and fabrication of fully-packaged RF modules that are suitable for integration in portable handset applications. The system blocks utilize high Q passive devices that are embedded in Liquid Crystalline Polymer (LCP) based substrates. Firstly, the paper introduces the packaging technology that utilizes multiple sheets of LCP substrate. Characterization of high Q inductors on the multi-layer process is then demonstrated showing scalability of inductor size and Q from 900 MHz to 10 GHz. Finally, the paper presents the results of the following key LCP based RF modules: voltage controlled oscillators, concurrent dual-band oscillators, mixers, filters, and baluns. A comparison with the current state-of-the-art is made. The paper shows that the implemented system modules are smaller in size, with superior electrical performance to currently available discrete solutions. The paper shows that the proposed technology supports high-density integration at low cost and hence, is suitable for large volume commercial wireless handheld applications. Finally, a MEMS process to be integrated on the proposed LCP technology for tunability of the modules is presented.
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U2 - 10.1109/IECON.2005.1569270
DO - 10.1109/IECON.2005.1569270
M3 - Conference contribution
AN - SCOPUS:33749661731
SN - 0780392523
SN - 9780780392526
T3 - IECON Proceedings (Industrial Electronics Conference)
SP - 2346
EP - 2351
BT - IECON 2005
T2 - IECON 2005: 31st Annual Conference of IEEE Industrial Electronics Society
Y2 - 6 November 2005 through 10 November 2005
ER -