Design and implementation of RF subsystems with multiple embedded passives in multi-layer organic substrates

V. Govind; S. Dalmia; J. Choi; M. Swaminathan

doi:10.1109/RAWCON.2003.1227958

Design and implementation of RF subsystems with multiple embedded passives in multi-layer organic substrates

V. Govind, S. Dalmia, J. Choi, M. Swaminathan

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Scopus citations

Abstract

Recent development in the design of high-Q passives embedded in low cost IC packages has made single-package integration of RF front-ends feasible. This paper analyses the effects of ground return in the performance of active circuits, while using multiple embedded devices in the package. The return-current path layout has been modeled using both electromagnetic field solvers as well as a circuit-based modeling methodology based on coupled line theory. Low noise amplifiers (LNAs) using discrete and embedded components have been designed and fabricated as test vehicles, and the modeled results have been verified with measurements.

Original language	English (US)
Title of host publication	Proceedings - 2003 IEEE Radio and Wireless Conference, RAWCON 2003
Editors	George Heiter
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	325-328
Number of pages	4
ISBN (Electronic)	0780378296, 9780780378292
DOIs	https://doi.org/10.1109/RAWCON.2003.1227958
State	Published - 2003
Event	2003 IEEE Radio and Wireless Conference, RAWCON 2003 - Boston, United States Duration: Aug 10 2003 → Aug 13 2003

Publication series

Name	Proceedings - 2003 IEEE Radio and Wireless Conference, RAWCON 2003

Conference

Conference	2003 IEEE Radio and Wireless Conference, RAWCON 2003
Country/Territory	United States
City	Boston
Period	8/10/03 → 8/13/03

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering
Computer Science Applications

Access to Document

10.1109/RAWCON.2003.1227958

Cite this

Govind, V., Dalmia, S., Choi, J., & Swaminathan, M. (2003). Design and implementation of RF subsystems with multiple embedded passives in multi-layer organic substrates. In G. Heiter (Ed.), Proceedings - 2003 IEEE Radio and Wireless Conference, RAWCON 2003 (pp. 325-328). Article 1227958 (Proceedings - 2003 IEEE Radio and Wireless Conference, RAWCON 2003). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/RAWCON.2003.1227958

Govind, V. ; Dalmia, S. ; Choi, J. et al. / Design and implementation of RF subsystems with multiple embedded passives in multi-layer organic substrates. Proceedings - 2003 IEEE Radio and Wireless Conference, RAWCON 2003. editor / George Heiter. Institute of Electrical and Electronics Engineers Inc., 2003. pp. 325-328 (Proceedings - 2003 IEEE Radio and Wireless Conference, RAWCON 2003).

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title = "Design and implementation of RF subsystems with multiple embedded passives in multi-layer organic substrates",

abstract = "Recent development in the design of high-Q passives embedded in low cost IC packages has made single-package integration of RF front-ends feasible. This paper analyses the effects of ground return in the performance of active circuits, while using multiple embedded devices in the package. The return-current path layout has been modeled using both electromagnetic field solvers as well as a circuit-based modeling methodology based on coupled line theory. Low noise amplifiers (LNAs) using discrete and embedded components have been designed and fabricated as test vehicles, and the modeled results have been verified with measurements.",

author = "V. Govind and S. Dalmia and J. Choi and M. Swaminathan",

note = "Publisher Copyright: {\textcopyright} 2003 IEEE.; 2003 IEEE Radio and Wireless Conference, RAWCON 2003 ; Conference date: 10-08-2003 Through 13-08-2003",

year = "2003",

doi = "10.1109/RAWCON.2003.1227958",

language = "English (US)",

series = "Proceedings - 2003 IEEE Radio and Wireless Conference, RAWCON 2003",

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Govind, V, Dalmia, S, Choi, J & Swaminathan, M 2003, Design and implementation of RF subsystems with multiple embedded passives in multi-layer organic substrates. in G Heiter (ed.), Proceedings - 2003 IEEE Radio and Wireless Conference, RAWCON 2003., 1227958, Proceedings - 2003 IEEE Radio and Wireless Conference, RAWCON 2003, Institute of Electrical and Electronics Engineers Inc., pp. 325-328, 2003 IEEE Radio and Wireless Conference, RAWCON 2003, Boston, United States, 8/10/03. https://doi.org/10.1109/RAWCON.2003.1227958

Design and implementation of RF subsystems with multiple embedded passives in multi-layer organic substrates. / Govind, V.; Dalmia, S.; Choi, J. et al.
Proceedings - 2003 IEEE Radio and Wireless Conference, RAWCON 2003. ed. / George Heiter. Institute of Electrical and Electronics Engineers Inc., 2003. p. 325-328 1227958 (Proceedings - 2003 IEEE Radio and Wireless Conference, RAWCON 2003).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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N2 - Recent development in the design of high-Q passives embedded in low cost IC packages has made single-package integration of RF front-ends feasible. This paper analyses the effects of ground return in the performance of active circuits, while using multiple embedded devices in the package. The return-current path layout has been modeled using both electromagnetic field solvers as well as a circuit-based modeling methodology based on coupled line theory. Low noise amplifiers (LNAs) using discrete and embedded components have been designed and fabricated as test vehicles, and the modeled results have been verified with measurements.

AB - Recent development in the design of high-Q passives embedded in low cost IC packages has made single-package integration of RF front-ends feasible. This paper analyses the effects of ground return in the performance of active circuits, while using multiple embedded devices in the package. The return-current path layout has been modeled using both electromagnetic field solvers as well as a circuit-based modeling methodology based on coupled line theory. Low noise amplifiers (LNAs) using discrete and embedded components have been designed and fabricated as test vehicles, and the modeled results have been verified with measurements.

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Govind V, Dalmia S, Choi J, Swaminathan M. Design and implementation of RF subsystems with multiple embedded passives in multi-layer organic substrates. In Heiter G, editor, Proceedings - 2003 IEEE Radio and Wireless Conference, RAWCON 2003. Institute of Electrical and Electronics Engineers Inc. 2003. p. 325-328. 1227958. (Proceedings - 2003 IEEE Radio and Wireless Conference, RAWCON 2003). doi: 10.1109/RAWCON.2003.1227958

Design and implementation of RF subsystems with multiple embedded passives in multi-layer organic substrates

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