Design and implementations of RF systems and sub-systems in LCP-type multilayer technology

S. Dalmia; V. Govind; J. Dekosky; V. Sundaram; G. White; M. Swaminathan

doi:10.1109/ECTC.2006.1645880

Design and implementations of RF systems and sub-systems in LCP-type multilayer technology

S. Dalmia, V. Govind, J. Dekosky, V. Sundaram, G. White, M. Swaminathan

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Scopus citations

Abstract

Miniaturization and data throughput are key driving factors in the growth and deployment of wireless LAN (WLAN) networks. This paper presents a novel LCP-based organic packaging technology for implementation of RF systems and sub-systems. Examples shown include low-profile baluns, bandpass filters and front-end modules (FEM) for 802.11a/b/g and 802.11n applications.

Original language	English (US)
Title of host publication	Proceedings - IEEE 56th Electronic Components and Technology Conference
Pages	1658-1662
Number of pages	5
DOIs	https://doi.org/10.1109/ECTC.2006.1645880
State	Published - 2006
Event	IEEE 56th Electronic Components and Technology Conference - San Diego, CA, United States Duration: May 30 2006 → Jun 2 2006

Publication series

Name	Proceedings - Electronic Components and Technology Conference
Volume	2006
ISSN (Print)	0569-5503

Conference

Conference	IEEE 56th Electronic Components and Technology Conference
Country/Territory	United States
City	San Diego, CA
Period	5/30/06 → 6/2/06

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/ECTC.2006.1645880

Cite this

Dalmia, S., Govind, V., Dekosky, J., Sundaram, V., White, G., & Swaminathan, M. (2006). Design and implementations of RF systems and sub-systems in LCP-type multilayer technology. In Proceedings - IEEE 56th Electronic Components and Technology Conference (pp. 1658-1662). Article 1645880 (Proceedings - Electronic Components and Technology Conference; Vol. 2006). https://doi.org/10.1109/ECTC.2006.1645880

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title = "Design and implementations of RF systems and sub-systems in LCP-type multilayer technology",

abstract = "Miniaturization and data throughput are key driving factors in the growth and deployment of wireless LAN (WLAN) networks. This paper presents a novel LCP-based organic packaging technology for implementation of RF systems and sub-systems. Examples shown include low-profile baluns, bandpass filters and front-end modules (FEM) for 802.11a/b/g and 802.11n applications.",

author = "S. Dalmia and V. Govind and J. Dekosky and V. Sundaram and G. White and M. Swaminathan",

year = "2006",

doi = "10.1109/ECTC.2006.1645880",

language = "English (US)",

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series = "Proceedings - Electronic Components and Technology Conference",

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booktitle = "Proceedings - IEEE 56th Electronic Components and Technology Conference",

note = "IEEE 56th Electronic Components and Technology Conference ; Conference date: 30-05-2006 Through 02-06-2006",

}

Dalmia, S, Govind, V, Dekosky, J, Sundaram, V, White, G & Swaminathan, M 2006, Design and implementations of RF systems and sub-systems in LCP-type multilayer technology. in Proceedings - IEEE 56th Electronic Components and Technology Conference., 1645880, Proceedings - Electronic Components and Technology Conference, vol. 2006, pp. 1658-1662, IEEE 56th Electronic Components and Technology Conference, San Diego, CA, United States, 5/30/06. https://doi.org/10.1109/ECTC.2006.1645880

Design and implementations of RF systems and sub-systems in LCP-type multilayer technology. / Dalmia, S.; Govind, V.; Dekosky, J. et al.
Proceedings - IEEE 56th Electronic Components and Technology Conference. 2006. p. 1658-1662 1645880 (Proceedings - Electronic Components and Technology Conference; Vol. 2006).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Design and implementations of RF systems and sub-systems in LCP-type multilayer technology

AU - Dalmia, S.

AU - Govind, V.

AU - Dekosky, J.

AU - Sundaram, V.

AU - White, G.

AU - Swaminathan, M.

PY - 2006

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AB - Miniaturization and data throughput are key driving factors in the growth and deployment of wireless LAN (WLAN) networks. This paper presents a novel LCP-based organic packaging technology for implementation of RF systems and sub-systems. Examples shown include low-profile baluns, bandpass filters and front-end modules (FEM) for 802.11a/b/g and 802.11n applications.

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T3 - Proceedings - Electronic Components and Technology Conference

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BT - Proceedings - IEEE 56th Electronic Components and Technology Conference

T2 - IEEE 56th Electronic Components and Technology Conference

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ER -

Design and implementations of RF systems and sub-systems in LCP-type multilayer technology

Abstract

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Conference

All Science Journal Classification (ASJC) codes

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