Design and optimization of high-Q RF passives on SOP-based organic substrates

Sidharth Dalmia, Joseph Martin Hobbs, Venky Sundaram, Madhavan Swaminathan, Seock Hee Lee, Farrokh Ayazi, George White, Swapan Bhattachary

Research output: Contribution to journalConference articlepeer-review

14 Scopus citations

Abstract

Integration of passive devices such as inductors and capacitors in packages or on silicon is an important step towards miniaturization and reduction of cost. These passive devices are used as stand-alone components or form an integral part of filters, oscillators, amplifiers, mixers and other RF circuits. This paper discusses the design of high Q inductors and high Q capacitors in organic substrates. Inductors with maximum quality factors in the range of 60-180 were obtained at frequencies in the 1-3 GHz band for inductances in the range of 1nH - 20nH. This is the first demonstration of such high Q inductors in organic substrates processed using low-temperature (<200°C) processes. The dimensions of all inductors are comparable to a Low Temperature Co-fired Ceramic (LTCC, <900°C) and Multichip Module Deposition (400°C<MCM-D<500°C) technology process and well suited for integration in a variety of applications. The paper also discusses the performance of embedded capacitors in organic substrates. Although the Q factors for the capacitors in organic technologies are comparable to ceramic technologies, they do not compare well with the performance of inductors. The results for embedded capacitors show the need for lower loss materials compared to the ones currently used in the low-temperature organic passive technology.

Original languageEnglish (US)
Pages (from-to)495-503
Number of pages9
JournalProceedings - Electronic Components and Technology Conference
StatePublished - 2002
Event52nd Electronic Components and Technology Conference - San Diego, CA, United States
Duration: May 28 2002May 31 2002

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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