Design, fabrication and characterization of low-cost glass interposers with fine-pitch through-package-vias

Vijay Sukumaran, Tapobrata Bandyopadhyay, Qiao Chen, Nitesh Kumbhat, Fuhan Liu, Raghu Pucha, Yoichiro Sato, Mitsuru Watanabe, Kenji Kitaoka, Motoshi Ono, Yuya Suzuki, Choukri Karoui, Christian Nopper, Madhavan Swaminathan, Venky Sundaram, Rao Tummala

Research output: Chapter in Book/Report/Conference proceedingConference contribution

88 Scopus citations

Abstract

This paper demonstrates thin glass interposers with fine pitch through package vias (TPV) as a low cost and high I/O substrate for 3D integration. Interposers for packaging of ULK and 3D-ICs need to support large numbers of die to die interconnections with I/O pitch below 50 μm. Current organic substrates are limited by CTE mismatch, wiring density, and poor dimensional stability. Wafer based silicon interposers can achieve high I/Os at fine pitch, but are limited by high cost. Glass is an ideal interposer material due to its insulating property, large panel availability and CTE match to silicon. The main focus of this work is on a) electrical and mechanical design, b) TPV and fine line formation and c) integration process and electrical characterization of thin glass interposers. This work for the first time demonstrates high throughput formation of 30 μm pitch TPVs in ultrathin glass using a parallel laser process. An integration process was demonstrated for glass interposer with polymer build-up layers on both sides. The glass interposer had stable electrical properties up to 20GHz and low insertion loss of less than 0.15dB was measured for TPVs at 9GHz.

Original languageEnglish (US)
Title of host publication2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011
Pages583-588
Number of pages6
DOIs
StatePublished - 2011
Event2011 61st Electronic Components and Technology Conference, ECTC 2011 - Lake Buena Vista, FL, United States
Duration: May 31 2011Jun 3 2011

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Conference

Conference2011 61st Electronic Components and Technology Conference, ECTC 2011
Country/TerritoryUnited States
CityLake Buena Vista, FL
Period5/31/116/3/11

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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