TY - GEN
T1 - Design, fabrication, and reliability assessment of embedded resistors and capacitors on multilayered organic substrates
AU - Lee, K. J.
AU - Bhattacharya, Swapan
AU - Varadarajan, Mahesh
AU - Wan, Lixi
AU - Abothu, Isaac Robin
AU - Sundaram, Venky
AU - Muthana, Prathap
AU - Balaraman, Devarajan
AU - Raj, P. M.
AU - Swaminathan, Madhavan
AU - Sitaraman, Suresh
AU - Tummala, Rao
AU - Viswanadham, Puligandla
AU - Dunford, Steven
AU - Lauffer, John
PY - 2005
Y1 - 2005
N2 - Embedded passives provide a practical solution to microelectronics miniaturization. In a typical circuit, over 80 percent of the electronic components are passives such as resistors, inductors, and capacitors that could take up to 50 percent of the entire printed circuit board area. By integrating passive components within the substrate, embedded passives reduce the system real estate, eliminate the need for discrete components and assembly of same, enhance electrical performance and reliability, and potentially reduce the overall cost. Moreover, it is lead free. Even with these advantages, embedded passive technology is at a relatively immature stage and more characterization and optimization are needed for practical applications leading to its commercialization. This paper presents an entire process from design and fabrication to electrical characterization and reliability test of embedded passives on multilayered microvia organic substrate. Two test vehicles focusing on resistors and capacitors have been designed and fabricated by Packaging Research Center (PRC) and Endicott Interconnect Technologies (EI). Resistors are carbon ink based Polymer Thick Film (PTF) and NiCrAlSi, and capacitors are made with polymer/ceramic nanocomposite material. High frequency measurement of these capacitors was performed. Furthermore, reliability assessments of thermal shock and temperature humidity tests based on JEDEC standards are presented.
AB - Embedded passives provide a practical solution to microelectronics miniaturization. In a typical circuit, over 80 percent of the electronic components are passives such as resistors, inductors, and capacitors that could take up to 50 percent of the entire printed circuit board area. By integrating passive components within the substrate, embedded passives reduce the system real estate, eliminate the need for discrete components and assembly of same, enhance electrical performance and reliability, and potentially reduce the overall cost. Moreover, it is lead free. Even with these advantages, embedded passive technology is at a relatively immature stage and more characterization and optimization are needed for practical applications leading to its commercialization. This paper presents an entire process from design and fabrication to electrical characterization and reliability test of embedded passives on multilayered microvia organic substrate. Two test vehicles focusing on resistors and capacitors have been designed and fabricated by Packaging Research Center (PRC) and Endicott Interconnect Technologies (EI). Resistors are carbon ink based Polymer Thick Film (PTF) and NiCrAlSi, and capacitors are made with polymer/ceramic nanocomposite material. High frequency measurement of these capacitors was performed. Furthermore, reliability assessments of thermal shock and temperature humidity tests based on JEDEC standards are presented.
UR - http://www.scopus.com/inward/record.url?scp=33746567874&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=33746567874&partnerID=8YFLogxK
U2 - 10.1109/ISAPM.2005.1432084
DO - 10.1109/ISAPM.2005.1432084
M3 - Conference contribution
AN - SCOPUS:33746567874
SN - 0780390857
SN - 9780780390850
T3 - Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces
SP - 249
EP - 254
BT - Proceedings - 2005 10th International Symposium on Advanced Packaging Materials
T2 - 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces
Y2 - 16 March 2005 through 18 March 2005
ER -