Design, fabrication, measurement and modeling of embedded inductors in laminate technology

Sung Hwan Min; Seock Hee Lee; Woopoung Kim; Sidharth Dalmia; Madhavan Swaminathan; Fuhan Liu; Rao R. Tummala

Design, fabrication, measurement and modeling of embedded inductors in laminate technology

Sung Hwan Min, Seock Hee Lee, Woopoung Kim, Sidharth Dalmia, Madhavan Swaminathan, Fuhan Liu, Rao R. Tummala

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

In this paper, several planar embedded inductors whose measured quality factors range from 20 to 90 were characterized in the frequency domain. The inductors were designed on FR-4 board using MCM-L technology with two metal layers and measured using TDR (Time Domain Reflectometry). Using the scattering parameters extracted from TDR measurements, scalable models were developed using the multidimensional cauchy method. A selective sampling algorithm was also investigated for developing the scalable models using electromagnetic (EM) simulation.

Original language	English (US)
Title of host publication	Advances in Electronic Packaging; Electrical Design, Simulation, and Test, Mems, Materials and Processing, Modeling and Characterization
Pages	75-79
Number of pages	5
State	Published - 2001
Event	Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition - Kauai, Hi, United States Duration: Jul 8 2001 → Jul 13 2001

Publication series

Name	Advances in Electronic Packaging
Volume	1

Conference

Conference	Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition
Country/Territory	United States
City	Kauai, Hi
Period	7/8/01 → 7/13/01

All Science Journal Classification (ASJC) codes

General Engineering
Electrical and Electronic Engineering

Cite this

Min, S. H., Lee, S. H., Kim, W., Dalmia, S., Swaminathan, M., Liu, F., & Tummala, R. R. (2001). Design, fabrication, measurement and modeling of embedded inductors in laminate technology. In Advances in Electronic Packaging; Electrical Design, Simulation, and Test, Mems, Materials and Processing, Modeling and Characterization (pp. 75-79). (Advances in Electronic Packaging; Vol. 1).

@inproceedings{f0c8978d49e14696bcb7f247f2816543,

title = "Design, fabrication, measurement and modeling of embedded inductors in laminate technology",

abstract = "In this paper, several planar embedded inductors whose measured quality factors range from 20 to 90 were characterized in the frequency domain. The inductors were designed on FR-4 board using MCM-L technology with two metal layers and measured using TDR (Time Domain Reflectometry). Using the scattering parameters extracted from TDR measurements, scalable models were developed using the multidimensional cauchy method. A selective sampling algorithm was also investigated for developing the scalable models using electromagnetic (EM) simulation.",

author = "Min, {Sung Hwan} and Lee, {Seock Hee} and Woopoung Kim and Sidharth Dalmia and Madhavan Swaminathan and Fuhan Liu and Tummala, {Rao R.}",

year = "2001",

language = "English (US)",

isbn = "0791835405",

series = "Advances in Electronic Packaging",

pages = "75--79",

booktitle = "Advances in Electronic Packaging; Electrical Design, Simulation, and Test, Mems, Materials and Processing, Modeling and Characterization",

note = "Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition ; Conference date: 08-07-2001 Through 13-07-2001",

}

Min, SH, Lee, SH, Kim, W, Dalmia, S, Swaminathan, M, Liu, F & Tummala, RR 2001, Design, fabrication, measurement and modeling of embedded inductors in laminate technology. in Advances in Electronic Packaging; Electrical Design, Simulation, and Test, Mems, Materials and Processing, Modeling and Characterization. Advances in Electronic Packaging, vol. 1, pp. 75-79, Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition, Kauai, Hi, United States, 7/8/01.

Design, fabrication, measurement and modeling of embedded inductors in laminate technology. / Min, Sung Hwan; Lee, Seock Hee; Kim, Woopoung et al.
Advances in Electronic Packaging; Electrical Design, Simulation, and Test, Mems, Materials and Processing, Modeling and Characterization. 2001. p. 75-79 (Advances in Electronic Packaging; Vol. 1).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Design, fabrication, measurement and modeling of embedded inductors in laminate technology

AU - Min, Sung Hwan

AU - Lee, Seock Hee

AU - Kim, Woopoung

AU - Dalmia, Sidharth

AU - Swaminathan, Madhavan

AU - Liu, Fuhan

AU - Tummala, Rao R.

PY - 2001

Y1 - 2001

N2 - In this paper, several planar embedded inductors whose measured quality factors range from 20 to 90 were characterized in the frequency domain. The inductors were designed on FR-4 board using MCM-L technology with two metal layers and measured using TDR (Time Domain Reflectometry). Using the scattering parameters extracted from TDR measurements, scalable models were developed using the multidimensional cauchy method. A selective sampling algorithm was also investigated for developing the scalable models using electromagnetic (EM) simulation.

AB - In this paper, several planar embedded inductors whose measured quality factors range from 20 to 90 were characterized in the frequency domain. The inductors were designed on FR-4 board using MCM-L technology with two metal layers and measured using TDR (Time Domain Reflectometry). Using the scattering parameters extracted from TDR measurements, scalable models were developed using the multidimensional cauchy method. A selective sampling algorithm was also investigated for developing the scalable models using electromagnetic (EM) simulation.

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M3 - Conference contribution

AN - SCOPUS:0346308586

SN - 0791835405

SN - 9780791835401

T3 - Advances in Electronic Packaging

SP - 75

EP - 79

BT - Advances in Electronic Packaging; Electrical Design, Simulation, and Test, Mems, Materials and Processing, Modeling and Characterization

T2 - Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition

Y2 - 8 July 2001 through 13 July 2001

ER -

Design, fabrication, measurement and modeling of embedded inductors in laminate technology

Abstract

Publication series

Conference

All Science Journal Classification (ASJC) codes

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