Design-for-manufacturability (DFM) methodology and yield analysis for embedded RF circuits for system-in-package (SiP) applications

Souvik Mukherjee, Madhavan Swaminathan

Research output: Chapter in Book/Report/Conference proceedingConference contribution


The rapidly evolving telecommunications market has led to the need for advanced RF circuits. Complex multiband/multi-mode RF designs require accurate prediction early in the design schedule and time-to-market pressures require that design iterations be kept to a minimum. This paper presents a layout-level, multi-domain DFM methodology and yield optimization technique for embedded RF circuits for SiP-based wireless applications. The proposed concept consists of layout- level statistical diagnosis and yield optimization. The statistical analysis takes into account the effect of the thermo-mechanical stress and the process variations that are incurred in batch fabrication. The results show good correlation with measurement/electromagnetic (EM) data.

Original languageEnglish (US)
Title of host publication2006 Asia-Pacific Microwave Conference Proceedings, APMC
Number of pages4
StatePublished - 2006
Event2006 Asia-Pacific Microwave Conference, APMC - Yokohama, Japan
Duration: Dec 12 2006Dec 15 2006

Publication series

NameAsia-Pacific Microwave Conference Proceedings, APMC


Conference2006 Asia-Pacific Microwave Conference, APMC

All Science Journal Classification (ASJC) codes

  • General Engineering


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