TY - GEN
T1 - Design-for-manufacturability (DFM) methodology and yield analysis for embedded RF circuits for system-in-package (SiP) applications
AU - Mukherjee, Souvik
AU - Swaminathan, Madhavan
PY - 2006
Y1 - 2006
N2 - The rapidly evolving telecommunications market has led to the need for advanced RF circuits. Complex multiband/multi-mode RF designs require accurate prediction early in the design schedule and time-to-market pressures require that design iterations be kept to a minimum. This paper presents a layout-level, multi-domain DFM methodology and yield optimization technique for embedded RF circuits for SiP-based wireless applications. The proposed concept consists of layout- level statistical diagnosis and yield optimization. The statistical analysis takes into account the effect of the thermo-mechanical stress and the process variations that are incurred in batch fabrication. The results show good correlation with measurement/electromagnetic (EM) data.
AB - The rapidly evolving telecommunications market has led to the need for advanced RF circuits. Complex multiband/multi-mode RF designs require accurate prediction early in the design schedule and time-to-market pressures require that design iterations be kept to a minimum. This paper presents a layout-level, multi-domain DFM methodology and yield optimization technique for embedded RF circuits for SiP-based wireless applications. The proposed concept consists of layout- level statistical diagnosis and yield optimization. The statistical analysis takes into account the effect of the thermo-mechanical stress and the process variations that are incurred in batch fabrication. The results show good correlation with measurement/electromagnetic (EM) data.
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U2 - 10.1109/APMC.2006.4429442
DO - 10.1109/APMC.2006.4429442
M3 - Conference contribution
AN - SCOPUS:44849142489
SN - 4902339080
SN - 9784902339086
T3 - Asia-Pacific Microwave Conference Proceedings, APMC
SP - 373
EP - 376
BT - 2006 Asia-Pacific Microwave Conference Proceedings, APMC
T2 - 2006 Asia-Pacific Microwave Conference, APMC
Y2 - 12 December 2006 through 15 December 2006
ER -