TY - GEN
T1 - Design of power delivery networks using power transmission lines and pseudo-balanced signaling for multiple I/Os
AU - Huh, Suzanne
AU - Swaminathan, Madhavan
AU - Keezer, David
PY - 2011
Y1 - 2011
N2 - Return path discontinuities (RPDs) cause the coupling between signal lines and the power delivery network, resulting in power supply noise and reduced timing and voltage margins at high speed. Prior work focused at reducing the RPD effect, usually through the use of power planes and decoupling capacitors. A new approach to address this issue replaces the plane structure with power transmission lines (PTLs), which removes the RPD effect. By eliminating the RPDs, the power supply noise is minimized. Therefore, voltage and timing margins can be improved to support higher data rates. In this paper, the application of the PTL is extended to the transmission of multiple parallel bits, and the resulting waveforms are compared to those using conventional power planes. Also, a new pseudo-balanced signaling scheme is used to further enhance signal integrity when using the PTL approach.
AB - Return path discontinuities (RPDs) cause the coupling between signal lines and the power delivery network, resulting in power supply noise and reduced timing and voltage margins at high speed. Prior work focused at reducing the RPD effect, usually through the use of power planes and decoupling capacitors. A new approach to address this issue replaces the plane structure with power transmission lines (PTLs), which removes the RPD effect. By eliminating the RPDs, the power supply noise is minimized. Therefore, voltage and timing margins can be improved to support higher data rates. In this paper, the application of the PTL is extended to the transmission of multiple parallel bits, and the resulting waveforms are compared to those using conventional power planes. Also, a new pseudo-balanced signaling scheme is used to further enhance signal integrity when using the PTL approach.
UR - http://www.scopus.com/inward/record.url?scp=84855370027&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84855370027&partnerID=8YFLogxK
U2 - 10.1109/EPEPS.2011.6100248
DO - 10.1109/EPEPS.2011.6100248
M3 - Conference contribution
AN - SCOPUS:84855370027
SN - 9781424493999
T3 - 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011
SP - 287
EP - 290
BT - 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011
T2 - 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011
Y2 - 23 October 2011 through 26 October 2011
ER -