Design, simulation and measurement techniques for embedded decoupling capacitors in multi-GHz packages/PCBs

Lixi Wan, P. Markondeya Raj, M. Swaminathan, R. Tummala

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Scopus citations

Abstract

Embedded capacitor is a better solution than surface mount capacitors for decoupling in a high speed, high performance packages/PCBs. Our study has showed that with conventional approaches, the embedded capacitor for decoupling in power delivering network can work from 100 MHz to 1 GHz systems. Pushing the operating frequency over 1 GHz is a challenge for system designers. This paper will discuss the embedded decoupling capacitor design for multi-GHz systems through principles, simulation, measurement error, and error elimination.

Original languageEnglish (US)
Title of host publication2005 6th International Conference on Electronics Packaging Technology
PublisherIEEE Computer Society
Pages108-112
Number of pages5
ISBN (Print)0780394496, 9780780394490
DOIs
StatePublished - 2005
Event2005 6th International Conference on Electronics Packaging Technology - Dameisha, Shenzhen, China
Duration: Aug 30 2005Sep 2 2005

Publication series

Name2005 6th International Conference on Electronics Packaging Technology
Volume2005

Conference

Conference2005 6th International Conference on Electronics Packaging Technology
Country/TerritoryChina
CityDameisha, Shenzhen
Period8/30/059/2/05

All Science Journal Classification (ASJC) codes

  • General Engineering

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