Design Tradeoffs Among MCM-C, MCM-D and MCM-D/C Technologies

Asif Iqbal, Madhavan Swaminathan, Michael Nealon, Ahmed Omer

Research output: Contribution to journalArticlepeer-review

13 Scopus citations


The paper describes tradeoffs in electrical performance, wiring density and cost for MCM-C, MCM-D and MCM-D/C technologies. The thin and thick film interconnection media are compared with their associated pros and cons in terms of performance and cost.

Original languageEnglish (US)
Pages (from-to)22-29
Number of pages8
JournalIEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging
Issue number1
StatePublished - Feb 1994

All Science Journal Classification (ASJC) codes

  • General Engineering


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