TY - JOUR
T1 - Design Tradeoffs Among MCM-C, MCM-D and MCM-D/C Technologies
AU - Iqbal, Asif
AU - Swaminathan, Madhavan
AU - Nealon, Michael
AU - Omer, Ahmed
PY - 1994/2
Y1 - 1994/2
N2 - The paper describes tradeoffs in electrical performance, wiring density and cost for MCM-C, MCM-D and MCM-D/C technologies. The thin and thick film interconnection media are compared with their associated pros and cons in terms of performance and cost.
AB - The paper describes tradeoffs in electrical performance, wiring density and cost for MCM-C, MCM-D and MCM-D/C technologies. The thin and thick film interconnection media are compared with their associated pros and cons in terms of performance and cost.
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U2 - 10.1109/96.296427
DO - 10.1109/96.296427
M3 - Article
AN - SCOPUS:0028374260
SN - 1070-9894
VL - 17
SP - 22
EP - 29
JO - IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging
JF - IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging
IS - 1
ER -