Design tradeoffs among MCM-C, MCM-D and MCM-D/C technologies

Asif Iqbal, Madhavan Swaminathan, Michael Nealon, Ahmed Omer

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

The paper describes tradeoffs in electrical performance, wiring density and cost for MCM-C, MCM-D and MCM-D/C technologies. The thin and thick film interconnection media are compared with their associated pros and cons in terms of performance and cost.

Original languageEnglish (US)
Title of host publicationProceedings 1993 IEEE Multi-Chip Module Conference
PublisherPubl by IEEE
Pages12-17
Number of pages6
ISBN (Print)0818635401
StatePublished - 1993
EventProceedings of the 1993 IEEE Multi-Chip Module Conference - MCMC-93 - Santa Cruz, CA, USA
Duration: Mar 15 1993Mar 18 1993

Publication series

NameProceedings 1993 IEEE Multi-Chip Module Conference

Conference

ConferenceProceedings of the 1993 IEEE Multi-Chip Module Conference - MCMC-93
CitySanta Cruz, CA, USA
Period3/15/933/18/93

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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