Design tradeoffs among MCM-C, MCM-D and MCM-D/C technologies

Asif Iqbal; Madhavan Swaminathan; Michael Nealon; Ahmed Omer

Design tradeoffs among MCM-C, MCM-D and MCM-D/C technologies

Asif Iqbal, Madhavan Swaminathan, Michael Nealon, Ahmed Omer

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Scopus citations

Abstract

The paper describes tradeoffs in electrical performance, wiring density and cost for MCM-C, MCM-D and MCM-D/C technologies. The thin and thick film interconnection media are compared with their associated pros and cons in terms of performance and cost.

Original language	English (US)
Title of host publication	Proceedings 1993 IEEE Multi-Chip Module Conference
Publisher	Publ by IEEE
Pages	12-17
Number of pages	6
ISBN (Print)	0818635401
State	Published - 1993
Event	Proceedings of the 1993 IEEE Multi-Chip Module Conference - MCMC-93 - Santa Cruz, CA, USA Duration: Mar 15 1993 → Mar 18 1993

Publication series

Name	Proceedings 1993 IEEE Multi-Chip Module Conference

Conference

Conference	Proceedings of the 1993 IEEE Multi-Chip Module Conference - MCMC-93
City	Santa Cruz, CA, USA
Period	3/15/93 → 3/18/93

All Science Journal Classification (ASJC) codes

General Engineering

Cite this

@inproceedings{0a940168069f41e39c0dfa40d0f50c73,

title = "Design tradeoffs among MCM-C, MCM-D and MCM-D/C technologies",

abstract = "The paper describes tradeoffs in electrical performance, wiring density and cost for MCM-C, MCM-D and MCM-D/C technologies. The thin and thick film interconnection media are compared with their associated pros and cons in terms of performance and cost.",

author = "Asif Iqbal and Madhavan Swaminathan and Michael Nealon and Ahmed Omer",

year = "1993",

language = "English (US)",

isbn = "0818635401",

series = "Proceedings 1993 IEEE Multi-Chip Module Conference",

publisher = "Publ by IEEE",

pages = "12--17",

booktitle = "Proceedings 1993 IEEE Multi-Chip Module Conference",

note = "Proceedings of the 1993 IEEE Multi-Chip Module Conference - MCMC-93 ; Conference date: 15-03-1993 Through 18-03-1993",

}

TY - GEN

T1 - Design tradeoffs among MCM-C, MCM-D and MCM-D/C technologies

AU - Iqbal, Asif

AU - Swaminathan, Madhavan

AU - Nealon, Michael

AU - Omer, Ahmed

PY - 1993

Y1 - 1993

N2 - The paper describes tradeoffs in electrical performance, wiring density and cost for MCM-C, MCM-D and MCM-D/C technologies. The thin and thick film interconnection media are compared with their associated pros and cons in terms of performance and cost.

AB - The paper describes tradeoffs in electrical performance, wiring density and cost for MCM-C, MCM-D and MCM-D/C technologies. The thin and thick film interconnection media are compared with their associated pros and cons in terms of performance and cost.

UR - http://www.scopus.com/inward/record.url?scp=0027146717&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0027146717&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0027146717

SN - 0818635401

T3 - Proceedings 1993 IEEE Multi-Chip Module Conference

SP - 12

EP - 17

BT - Proceedings 1993 IEEE Multi-Chip Module Conference

PB - Publ by IEEE

T2 - Proceedings of the 1993 IEEE Multi-Chip Module Conference - MCMC-93

Y2 - 15 March 1993 through 18 March 1993

ER -

Design tradeoffs among MCM-C, MCM-D and MCM-D/C technologies

Abstract

Publication series

Conference

All Science Journal Classification (ASJC) codes

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