Abstract
It has been almost two decades since the target impedance concept was first proposed for the design of power distribution networks. Both academia and industry have come a long way since then by proposing solutions for managing power integrity in packages and printed circuit boards (PCB). This paper briefly reviews the past and identifies challenges that need to be addressed in the future for tackling this problem. These challenges are often times opportunities for research that can lead to interesting and often times innovative solutions. Some ideas for managing power integrity in the future are discussed in this paper.
| Original language | English (US) |
|---|---|
| Pages | 60-66 |
| Number of pages | 7 |
| Volume | 2 |
| No | 3 |
| Specialist publication | IEEE Electromagnetic Compatibility Magazine |
| State | Published - Sep 1 2013 |
All Science Journal Classification (ASJC) codes
- Software
- Signal Processing
- Instrumentation
- Computer Networks and Communications
- Electrical and Electronic Engineering