Keyphrases
Annealing
50%
Ar Pressure
25%
Co-sputtering
50%
Complementary Metal Oxide Semiconductor
25%
Corrosion Resistance
25%
Crack-free
25%
Ductility
50%
Electrical Conductivity
25%
Etchant
25%
Fixed Beam
25%
Fracture Toughness
25%
Grain Size
25%
High Melting Temperature
25%
High Strength
25%
Intermetallics
100%
Micro-electro-mechanical Systems
100%
Multilayer Stack
25%
Near-room Temperature
25%
NiAl
100%
Ordered Intermetallics
25%
Oxidation Resistance
25%
Resonator
25%
Room Temperature
50%
Sacrificial Layer
25%
Semiconductor Processing
25%
SiGe
25%
Size Reduction
25%
Temperature Stability
25%
Thermal Stability
25%
XeF2
25%
Material Science
Actuator
25%
Annealing
50%
Complementary Metal-Oxide-Semiconductor Device
25%
Corrosion Resistance
25%
Electrical Conductivity
25%
Film
100%
Fracture Toughness
25%
Grain Size
25%
Intermetallics
100%
Mechanical Strength
25%
Microelectromechanical System
100%
Oxidation Resistance
25%
Resonator
25%
Thermal Stability
25%
Thin Films
50%
Engineering
Complementary Metal-Oxide-Semiconductor
25%
Corrosion Resistance
25%
Electrical Conductivity
25%
Fixed Beam
25%
Impact Toughness
25%
Intermetallics
100%
Melting Temperature
25%
Microelectromechanical System
100%
Oxidation Resistance
25%
Resonator
25%
Room Temperature
75%
Tensiles
25%
Thin Films
50%