Abstract
For rapid prototyping and repair of printed wiring boards, direct laser patterning techniques of Cu are investigated. Laser direct writing techniques reported in the literature are compared and contrasted. The approach taken in this work is laser-induced Ag seeding of the substrate followed by subsequent electroless Cu plating. The Ag seeds were deposited on FR4 and Al 2O3 substrates using 3rd harmonic Nd:YVO 4 and CO2 laser beams. Laser-written Ag seeds were catalytic for electroless deposition of Cu. A minimum resistivity of 6 μΩ-cm was obtained.
Original language | English (US) |
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DOIs | |
State | Published - 2006 |
Event | ICALEO 2006 - 25th International Congress on Applications of Laser and Electro-Optics - Scottsdale, AZ, United States Duration: Oct 30 2006 → Nov 2 2006 |
Other
Other | ICALEO 2006 - 25th International Congress on Applications of Laser and Electro-Optics |
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Country/Territory | United States |
City | Scottsdale, AZ |
Period | 10/30/06 → 11/2/06 |
All Science Journal Classification (ASJC) codes
- Geochemistry and Petrology
- Electrical and Electronic Engineering