Abstract
Electrical stress testing of polysilicon TFTs is a very valuable tool for addressing concerns about device reliability and stability. We have examined two distinct bias stresses on ECR and RF hydrogenated polysilicon TFTs and have compared the degradation mechanisms in n- and p-channel devices. We present evidence that hydrogen motion can play a role in TFT response to these stresses and show that the response can be very different for n- and p-channel TFTs.
Original language | English (US) |
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Pages | 115-117 |
Number of pages | 3 |
State | Published - 1995 |
Event | Proceedings of the 1995 2nd International Workshop on Active Liquid Crystal Displays, AMLCDs - Bethlehem, PA, USA Duration: Sep 25 1995 → Sep 26 1995 |
Other
Other | Proceedings of the 1995 2nd International Workshop on Active Liquid Crystal Displays, AMLCDs |
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City | Bethlehem, PA, USA |
Period | 9/25/95 → 9/26/95 |
All Science Journal Classification (ASJC) codes
- General Engineering