Die-Embedded Glass Interposer with Minimum Warpage for 5G/6G Applications

Xingchen Li; Xiaofan Jia; Joon Woo Kim; Kyoung Sik Moon; Matthew B. Jordan; Madhavan Swaminathan

doi:10.1109/ECTC51909.2023.00389

Die-Embedded Glass Interposer with Minimum Warpage for 5G/6G Applications

Xingchen Li, Xiaofan Jia, Joon Woo Kim, Kyoung Sik Moon, Matthew B. Jordan, Madhavan Swaminathan

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

4 Scopus citations

Abstract

This paper presents a die-embedded glass interposer with minimum warpage for 5G/6G applications. The interposer performs high integration with low-loss interconnects by embedding multiple chips in the same glass substrate and interconnecting the chips through redistributive layers (RDL). Novel processes for cavity creation, multi-die embedding, carrier- less RDL build up and heat spreader attachment are proposed and demonstrated in this work. Performance of the interposer from 1 GHz to 110 GHz are evaluated. This work provides an advanced packaging solution for low-loss die-to-die and die-to-package interconnects, which is essential to high performance wireless system integration.

Original language	English (US)
Title of host publication	Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	2247-2254
Number of pages	8
ISBN (Electronic)	9798350334982
DOIs	https://doi.org/10.1109/ECTC51909.2023.00389
State	Published - 2023
Event	73rd IEEE Electronic Components and Technology Conference, ECTC 2023 - Orlando, United States Duration: May 30 2023 → Jun 2 2023

Publication series

Name	Proceedings - Electronic Components and Technology Conference
Volume	2023-May
ISSN (Print)	0569-5503

Conference

Conference	73rd IEEE Electronic Components and Technology Conference, ECTC 2023
Country/Territory	United States
City	Orlando
Period	5/30/23 → 6/2/23

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/ECTC51909.2023.00389

Cite this

Li, X., Jia, X., Kim, J. W., Moon, K. S., Jordan, M. B., & Swaminathan, M. (2023). Die-Embedded Glass Interposer with Minimum Warpage for 5G/6G Applications. In Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023 (pp. 2247-2254). (Proceedings - Electronic Components and Technology Conference; Vol. 2023-May). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC51909.2023.00389

@inproceedings{154407b3a61c4bdfae7163ff217a5b6e,

title = "Die-Embedded Glass Interposer with Minimum Warpage for 5G/6G Applications",

abstract = "This paper presents a die-embedded glass interposer with minimum warpage for 5G/6G applications. The interposer performs high integration with low-loss interconnects by embedding multiple chips in the same glass substrate and interconnecting the chips through redistributive layers (RDL). Novel processes for cavity creation, multi-die embedding, carrier- less RDL build up and heat spreader attachment are proposed and demonstrated in this work. Performance of the interposer from 1 GHz to 110 GHz are evaluated. This work provides an advanced packaging solution for low-loss die-to-die and die-to-package interconnects, which is essential to high performance wireless system integration.",

author = "Xingchen Li and Xiaofan Jia and Kim, {Joon Woo} and Moon, {Kyoung Sik} and Jordan, {Matthew B.} and Madhavan Swaminathan",

note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 73rd IEEE Electronic Components and Technology Conference, ECTC 2023 ; Conference date: 30-05-2023 Through 02-06-2023",

year = "2023",

doi = "10.1109/ECTC51909.2023.00389",

language = "English (US)",

series = "Proceedings - Electronic Components and Technology Conference",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "2247--2254",

booktitle = "Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023",

address = "United States",

}

Li, X, Jia, X, Kim, JW, Moon, KS, Jordan, MB & Swaminathan, M 2023, Die-Embedded Glass Interposer with Minimum Warpage for 5G/6G Applications. in Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023. Proceedings - Electronic Components and Technology Conference, vol. 2023-May, Institute of Electrical and Electronics Engineers Inc., pp. 2247-2254, 73rd IEEE Electronic Components and Technology Conference, ECTC 2023, Orlando, United States, 5/30/23. https://doi.org/10.1109/ECTC51909.2023.00389

Die-Embedded Glass Interposer with Minimum Warpage for 5G/6G Applications. / Li, Xingchen; Jia, Xiaofan; Kim, Joon Woo et al.
Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023. Institute of Electrical and Electronics Engineers Inc., 2023. p. 2247-2254 (Proceedings - Electronic Components and Technology Conference; Vol. 2023-May).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Die-Embedded Glass Interposer with Minimum Warpage for 5G/6G Applications

AU - Li, Xingchen

AU - Jia, Xiaofan

AU - Kim, Joon Woo

AU - Moon, Kyoung Sik

AU - Jordan, Matthew B.

AU - Swaminathan, Madhavan

PY - 2023

Y1 - 2023

N2 - This paper presents a die-embedded glass interposer with minimum warpage for 5G/6G applications. The interposer performs high integration with low-loss interconnects by embedding multiple chips in the same glass substrate and interconnecting the chips through redistributive layers (RDL). Novel processes for cavity creation, multi-die embedding, carrier- less RDL build up and heat spreader attachment are proposed and demonstrated in this work. Performance of the interposer from 1 GHz to 110 GHz are evaluated. This work provides an advanced packaging solution for low-loss die-to-die and die-to-package interconnects, which is essential to high performance wireless system integration.

AB - This paper presents a die-embedded glass interposer with minimum warpage for 5G/6G applications. The interposer performs high integration with low-loss interconnects by embedding multiple chips in the same glass substrate and interconnecting the chips through redistributive layers (RDL). Novel processes for cavity creation, multi-die embedding, carrier- less RDL build up and heat spreader attachment are proposed and demonstrated in this work. Performance of the interposer from 1 GHz to 110 GHz are evaluated. This work provides an advanced packaging solution for low-loss die-to-die and die-to-package interconnects, which is essential to high performance wireless system integration.

UR - http://www.scopus.com/inward/record.url?scp=85168307572&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85168307572&partnerID=8YFLogxK

U2 - 10.1109/ECTC51909.2023.00389

DO - 10.1109/ECTC51909.2023.00389

M3 - Conference contribution

AN - SCOPUS:85168307572

T3 - Proceedings - Electronic Components and Technology Conference

SP - 2247

EP - 2254

BT - Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 73rd IEEE Electronic Components and Technology Conference, ECTC 2023

Y2 - 30 May 2023 through 2 June 2023

ER -

Li X, Jia X, Kim JW, Moon KS, Jordan MB, Swaminathan M. Die-Embedded Glass Interposer with Minimum Warpage for 5G/6G Applications. In Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023. Institute of Electrical and Electronics Engineers Inc. 2023. p. 2247-2254. (Proceedings - Electronic Components and Technology Conference). doi: 10.1109/ECTC51909.2023.00389

Die-Embedded Glass Interposer with Minimum Warpage for 5G/6G Applications

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