TY - GEN
T1 - Die-Embedded Glass Interposer with Minimum Warpage for 5G/6G Applications
AU - Li, Xingchen
AU - Jia, Xiaofan
AU - Kim, Joon Woo
AU - Moon, Kyoung Sik
AU - Jordan, Matthew B.
AU - Swaminathan, Madhavan
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - This paper presents a die-embedded glass interposer with minimum warpage for 5G/6G applications. The interposer performs high integration with low-loss interconnects by embedding multiple chips in the same glass substrate and interconnecting the chips through redistributive layers (RDL). Novel processes for cavity creation, multi-die embedding, carrier- less RDL build up and heat spreader attachment are proposed and demonstrated in this work. Performance of the interposer from 1 GHz to 110 GHz are evaluated. This work provides an advanced packaging solution for low-loss die-to-die and die-to-package interconnects, which is essential to high performance wireless system integration.
AB - This paper presents a die-embedded glass interposer with minimum warpage for 5G/6G applications. The interposer performs high integration with low-loss interconnects by embedding multiple chips in the same glass substrate and interconnecting the chips through redistributive layers (RDL). Novel processes for cavity creation, multi-die embedding, carrier- less RDL build up and heat spreader attachment are proposed and demonstrated in this work. Performance of the interposer from 1 GHz to 110 GHz are evaluated. This work provides an advanced packaging solution for low-loss die-to-die and die-to-package interconnects, which is essential to high performance wireless system integration.
UR - http://www.scopus.com/inward/record.url?scp=85168307572&partnerID=8YFLogxK
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U2 - 10.1109/ECTC51909.2023.00389
DO - 10.1109/ECTC51909.2023.00389
M3 - Conference contribution
AN - SCOPUS:85168307572
T3 - Proceedings - Electronic Components and Technology Conference
SP - 2247
EP - 2254
BT - Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 73rd IEEE Electronic Components and Technology Conference, ECTC 2023
Y2 - 30 May 2023 through 2 June 2023
ER -