Die-Embedded Glass Interposer with Minimum Warpage for 5G/6G Applications

Xingchen Li, Xiaofan Jia, Joon Woo Kim, Kyoung Sik Moon, Matthew B. Jordan, Madhavan Swaminathan

Research output: Chapter in Book/Report/Conference proceedingConference contribution


This paper presents a die-embedded glass interposer with minimum warpage for 5G/6G applications. The interposer performs high integration with low-loss interconnects by embedding multiple chips in the same glass substrate and interconnecting the chips through redistributive layers (RDL). Novel processes for cavity creation, multi-die embedding, carrier- less RDL build up and heat spreader attachment are proposed and demonstrated in this work. Performance of the interposer from 1 GHz to 110 GHz are evaluated. This work provides an advanced packaging solution for low-loss die-to-die and die-to-package interconnects, which is essential to high performance wireless system integration.

Original languageEnglish (US)
Title of host publicationProceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages8
ISBN (Electronic)9798350334982
StatePublished - 2023
Event73rd IEEE Electronic Components and Technology Conference, ECTC 2023 - Orlando, United States
Duration: May 30 2023Jun 2 2023

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503


Conference73rd IEEE Electronic Components and Technology Conference, ECTC 2023
Country/TerritoryUnited States

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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