Abstract
This work presents the design and fabrication of an antenna-integrated glass package with embedded die for D-band (110–170 GHz) wireless applications. The proposed package uses glass as the core material, in which dies are embedded. The redistribution layer (RDL) for electrical connections is fabricated on low-loss polymeric build-up films (ABF-GL102). The vertical interconnects between the dies and the package are implemented using laser-drilled micro-vias. The RDL supports two metal layers which include an 8-element series-fed microstrip patch antenna array. With micro-vias and transmission lines integrated into the low-loss polymer, the die-embedded glass package provides low-loss and low-parasitic die-to-die and die-to-antenna interconnects. Graphical abstract: [Figure not available: see fulltext.]
Original language | English (US) |
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Pages (from-to) | 630-634 |
Number of pages | 5 |
Journal | MRS Advances |
Volume | 7 |
Issue number | 29 |
DOIs | |
State | Published - Oct 2022 |
All Science Journal Classification (ASJC) codes
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering