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Keyphrases
Dielectric Behavior
100%
Plasma-enhanced Chemical Vapor Deposition (PECVD)
100%
Vinylidene Fluoride
100%
Silicon Nitride
100%
Chlorotrifluoroethylene
100%
Low-temperature Plasma
100%
Bilayer Film
100%
Low Dielectric Loss
50%
Dielectric Constant
50%
Conduction Losses
50%
High Electric Field
25%
High Energy Density
25%
Poly(vinylidene fluoride-trifluoroethylene)
25%
Dielectric Layer
25%
High Resistivity
25%
Loss Reduction
25%
Film Fabrication
25%
High Discharged Energy Density
25%
Engineering
Low-Temperature
100%
Dielectrics
100%
Chemical Vapor Deposition
100%
Vapor Deposition
100%
Temperature Plasma
100%
Low Dielectric Loss
66%
Conduction Loss
66%
Flux Density
66%
Experimental Result
33%
Discharged Energy
33%
Dielectric Layer
33%
High Electric Field
33%
Material Science
Film
100%
Plasma-Enhanced Chemical Vapor Deposition
100%
Silicon Nitride
100%
Dielectric Material
100%
Permittivity
25%
Energy Density
12%
Electrical Resistivity
12%
High Energy Density
12%
Chemical Engineering
Plasma Enhanced Chemical Vapor Deposition
100%
Film
100%