TY - JOUR
T1 - Dielectrophoretic assembly and integration of nanowire devices with functional CMOS operating circuitry
AU - Evoy, S.
AU - DiLello, N.
AU - Deshpande, V.
AU - Narayanan, A.
AU - Liu, H.
AU - Riegelman, M.
AU - Martin, B. R.
AU - Hailer, B.
AU - Bradley, J. C.
AU - Weiss, W.
AU - Mayer, T. S.
AU - Gogotsi, Y.
AU - Bau, H. H.
AU - Mallouk, T. E.
AU - Raman, S.
N1 - Funding Information:
A. Narayanan, S. Evoy, and S. Raman acknowledge funding from NSF collaborative research awards #ECS-0225439 and #ECS-0225496. They also thank Motorola Semiconductor Products Sector, Austin, TX, in particular Chris Magnella and Michael Clifford, for providing access to their HIP6W 0.18 μm BiCMOS technology for this project. N. DiLello and V. Deshpande have received summer salary support from NSF REU program #EEC-0244055.M. Riegelman, J.C. Bradley, Y. Gogotsi, and H.H. Bau are supported by NSF NIRT program #CTS-0210579. H. Liu and H.H. Bau are supported by DARPA SIMBIOS program N66001-01-C-8056. M. Riegelman also acknowledges further support from a GAANN fellowship. Transmission electron microscopy of carbon tubes was performed by Dr. H.Ye.B.R. Martin, W. Weiss, T.E. Mallouk, and T.S. Mayer were supported by DARPA and ONR under contract N00014-01-10659.
PY - 2004/7
Y1 - 2004/7
N2 - We present a novel platform for the development and deployment of nanosensors in integrated systems. The nanosensor technology is based on "striped" high aspect ratio cylindrical structures grown using porous membranes as templates. These nanostructures are manipulated using dielectrophoretic forces, allowing their individual assembly and characterization. This assembly also enables the development of "mixed-mode" integrated circuits that include readout, signal processing, and communications circuitry, as well as the requisite layout for the post-IC assembly of the nanostructures. We report on preliminary designs of such mixed mode systems whose layouts integrate dielectrophoretic assembly sites with a rudimentary resistance read-out circuitry.
AB - We present a novel platform for the development and deployment of nanosensors in integrated systems. The nanosensor technology is based on "striped" high aspect ratio cylindrical structures grown using porous membranes as templates. These nanostructures are manipulated using dielectrophoretic forces, allowing their individual assembly and characterization. This assembly also enables the development of "mixed-mode" integrated circuits that include readout, signal processing, and communications circuitry, as well as the requisite layout for the post-IC assembly of the nanostructures. We report on preliminary designs of such mixed mode systems whose layouts integrate dielectrophoretic assembly sites with a rudimentary resistance read-out circuitry.
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U2 - 10.1016/j.mee.2003.09.010
DO - 10.1016/j.mee.2003.09.010
M3 - Conference article
AN - SCOPUS:2942579312
SN - 0167-9317
VL - 75
SP - 31
EP - 42
JO - Microelectronic Engineering
JF - Microelectronic Engineering
IS - 1
T2 - Proceedings of the Symposium on Characterization
Y2 - 17 June 2003 through 20 June 2003
ER -