Diffusion Bonding of AgC–Cu Bi-layered Electrical Contacts

Daudi R. Waryoba; Linsea Paradis

doi:10.1007/978-3-030-36296-6_189

Diffusion Bonding of AgC–Cu Bi-layered Electrical Contacts

Daudi R. Waryoba, Linsea Paradis

Penn State DuBois

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Due to the immiscibility of graphite in copper and silver, the conventional press and sinter method for fabrication of bi-layered silver graphite-copper electrical contacts are a challenging process. During sintering of silver graphite-copper compacts, silver diffuses into copper leaving a trace of graphite at the interface. This creates a poor interface between the mating surfaces, thereby decreasing the shear strength of the joint. In this work, interlayers with different compositions were used to promote diffusion bonding at various sintering conditions. The results show that vacuum diffusion bonding using an interlayer of Ag–Cu, with eutectic composition, is an effective method for fabricating the AgC–Cu bilayer electrical contacts.

Original language	English (US)
Title of host publication	TMS 2020 149th Annual Meeting and Exhibition Supplemental Proceedings
Editors	Zhiwei Peng, Jiann-Yang Hwang, Jerome Downey, Dean Gregurek, Baojun Zhao, Onuralp Yucel, Ender Keskinkilic, Tao Jiang, Jesse White, Morsi Mahmoud
Publisher	Springer
Pages	2067-2075
Number of pages	9
ISBN (Print)	9783030362959
DOIs	https://doi.org/10.1007/978-3-030-36296-6_189
State	Published - 2020
Event	149th Annual Meeting and Exhibition of the Minerals, Metals and Materials Society, TMS 2020 - San Diego, United States Duration: Feb 23 2020 → Feb 27 2020

Publication series

Name	Minerals, Metals and Materials Series
ISSN (Print)	2367-1181
ISSN (Electronic)	2367-1696

Conference

Conference	149th Annual Meeting and Exhibition of the Minerals, Metals and Materials Society, TMS 2020
Country/Territory	United States
City	San Diego
Period	2/23/20 → 2/27/20

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Energy Engineering and Power Technology
Mechanics of Materials
Metals and Alloys
Materials Chemistry

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10.1007/978-3-030-36296-6_189

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Waryoba, D. R., & Paradis, L. (2020). Diffusion Bonding of AgC–Cu Bi-layered Electrical Contacts. In Z. Peng, J.-Y. Hwang, J. Downey, D. Gregurek, B. Zhao, O. Yucel, E. Keskinkilic, T. Jiang, J. White, & M. Mahmoud (Eds.), TMS 2020 149th Annual Meeting and Exhibition Supplemental Proceedings (pp. 2067-2075). (Minerals, Metals and Materials Series). Springer. https://doi.org/10.1007/978-3-030-36296-6_189

Waryoba, Daudi R. ; Paradis, Linsea. / Diffusion Bonding of AgC–Cu Bi-layered Electrical Contacts. TMS 2020 149th Annual Meeting and Exhibition Supplemental Proceedings. editor / Zhiwei Peng ; Jiann-Yang Hwang ; Jerome Downey ; Dean Gregurek ; Baojun Zhao ; Onuralp Yucel ; Ender Keskinkilic ; Tao Jiang ; Jesse White ; Morsi Mahmoud. Springer, 2020. pp. 2067-2075 (Minerals, Metals and Materials Series).

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title = "Diffusion Bonding of AgC–Cu Bi-layered Electrical Contacts",

abstract = "Due to the immiscibility of graphite in copper and silver, the conventional press and sinter method for fabrication of bi-layered silver graphite-copper electrical contacts are a challenging process. During sintering of silver graphite-copper compacts, silver diffuses into copper leaving a trace of graphite at the interface. This creates a poor interface between the mating surfaces, thereby decreasing the shear strength of the joint. In this work, interlayers with different compositions were used to promote diffusion bonding at various sintering conditions. The results show that vacuum diffusion bonding using an interlayer of Ag–Cu, with eutectic composition, is an effective method for fabricating the AgC–Cu bilayer electrical contacts.",

author = "Waryoba, {Daudi R.} and Linsea Paradis",

note = "Publisher Copyright: {\textcopyright} 2020, The Minerals, Metals & Materials Society.; 149th Annual Meeting and Exhibition of the Minerals, Metals and Materials Society, TMS 2020 ; Conference date: 23-02-2020 Through 27-02-2020",

year = "2020",

doi = "10.1007/978-3-030-36296-6_189",

language = "English (US)",

isbn = "9783030362959",

series = "Minerals, Metals and Materials Series",

publisher = "Springer",

pages = "2067--2075",

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Waryoba, DR & Paradis, L 2020, Diffusion Bonding of AgC–Cu Bi-layered Electrical Contacts. in Z Peng, J-Y Hwang, J Downey, D Gregurek, B Zhao, O Yucel, E Keskinkilic, T Jiang, J White & M Mahmoud (eds), TMS 2020 149th Annual Meeting and Exhibition Supplemental Proceedings. Minerals, Metals and Materials Series, Springer, pp. 2067-2075, 149th Annual Meeting and Exhibition of the Minerals, Metals and Materials Society, TMS 2020, San Diego, United States, 2/23/20. https://doi.org/10.1007/978-3-030-36296-6_189

Diffusion Bonding of AgC–Cu Bi-layered Electrical Contacts. / Waryoba, Daudi R.; Paradis, Linsea.
TMS 2020 149th Annual Meeting and Exhibition Supplemental Proceedings. ed. / Zhiwei Peng; Jiann-Yang Hwang; Jerome Downey; Dean Gregurek; Baojun Zhao; Onuralp Yucel; Ender Keskinkilic; Tao Jiang; Jesse White; Morsi Mahmoud. Springer, 2020. p. 2067-2075 (Minerals, Metals and Materials Series).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Diffusion Bonding of AgC–Cu Bi-layered Electrical Contacts

AU - Waryoba, Daudi R.

AU - Paradis, Linsea

PY - 2020

Y1 - 2020

N2 - Due to the immiscibility of graphite in copper and silver, the conventional press and sinter method for fabrication of bi-layered silver graphite-copper electrical contacts are a challenging process. During sintering of silver graphite-copper compacts, silver diffuses into copper leaving a trace of graphite at the interface. This creates a poor interface between the mating surfaces, thereby decreasing the shear strength of the joint. In this work, interlayers with different compositions were used to promote diffusion bonding at various sintering conditions. The results show that vacuum diffusion bonding using an interlayer of Ag–Cu, with eutectic composition, is an effective method for fabricating the AgC–Cu bilayer electrical contacts.

AB - Due to the immiscibility of graphite in copper and silver, the conventional press and sinter method for fabrication of bi-layered silver graphite-copper electrical contacts are a challenging process. During sintering of silver graphite-copper compacts, silver diffuses into copper leaving a trace of graphite at the interface. This creates a poor interface between the mating surfaces, thereby decreasing the shear strength of the joint. In this work, interlayers with different compositions were used to promote diffusion bonding at various sintering conditions. The results show that vacuum diffusion bonding using an interlayer of Ag–Cu, with eutectic composition, is an effective method for fabricating the AgC–Cu bilayer electrical contacts.

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BT - TMS 2020 149th Annual Meeting and Exhibition Supplemental Proceedings

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A2 - Zhao, Baojun

A2 - Yucel, Onuralp

A2 - Keskinkilic, Ender

A2 - Jiang, Tao

A2 - White, Jesse

A2 - Mahmoud, Morsi

PB - Springer

T2 - 149th Annual Meeting and Exhibition of the Minerals, Metals and Materials Society, TMS 2020

Y2 - 23 February 2020 through 27 February 2020

ER -

Waryoba DR, Paradis L. Diffusion Bonding of AgC–Cu Bi-layered Electrical Contacts. In Peng Z, Hwang JY, Downey J, Gregurek D, Zhao B, Yucel O, Keskinkilic E, Jiang T, White J, Mahmoud M, editors, TMS 2020 149th Annual Meeting and Exhibition Supplemental Proceedings. Springer. 2020. p. 2067-2075. (Minerals, Metals and Materials Series). doi: 10.1007/978-3-030-36296-6_189

Diffusion Bonding of AgC–Cu Bi-layered Electrical Contacts

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All Science Journal Classification (ASJC) codes

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