Diffusion Bonding of AgC–Cu Bi-layered Electrical Contacts

Daudi R. Waryoba, Linsea Paradis

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fingerprint

Dive into the research topics of 'Diffusion Bonding of AgC–Cu Bi-layered Electrical Contacts'. Together they form a unique fingerprint.

Engineering & Materials Science

Chemical Compounds