TY - GEN
T1 - Diffusion bonding of bi-layered silver graphite-copper electrical contacts
AU - Waryoba, Daudi R.
AU - Johnson, Jeffery A.
AU - Stringer, Craig
N1 - Funding Information:
This work was financed partially by the Ministry of Science, technology and Development of the Republic of Serbia and the results of studies on Project 143041B. the authors are grateful to Prof. Dr. Slobodan Sukdolak for his helpful collaboration in this work.
PY - 2014
Y1 - 2014
N2 - Due to economic considerations, companies that produce electrical contacts are shifting from singlelayered to bi-layered electrical contacts. In this method, a thin layer of refractory based material (e.g. silver-graphite, silver-tungsten, silver-tungsten carbide) is bonded to a layer of pure copper (Cu) to create a bi-layered contact. Unfortunately, the traditional press, sinter, repress method has not been successful in producing bi-layered (clad) silver graphite (AgC)-Cu electrical contacts due to the presence of carbon (graphite) at the interface, as carbon is not diffusible into either silver or copper. This leaves a poor interface between the AgC section and the copper section decreasing the shear strength of the joint. This paper presents the results on the use of NiCr and Fe interlayers for diffusion bonding of bi-layered AgCCu electrical contacts.
AB - Due to economic considerations, companies that produce electrical contacts are shifting from singlelayered to bi-layered electrical contacts. In this method, a thin layer of refractory based material (e.g. silver-graphite, silver-tungsten, silver-tungsten carbide) is bonded to a layer of pure copper (Cu) to create a bi-layered contact. Unfortunately, the traditional press, sinter, repress method has not been successful in producing bi-layered (clad) silver graphite (AgC)-Cu electrical contacts due to the presence of carbon (graphite) at the interface, as carbon is not diffusible into either silver or copper. This leaves a poor interface between the AgC section and the copper section decreasing the shear strength of the joint. This paper presents the results on the use of NiCr and Fe interlayers for diffusion bonding of bi-layered AgCCu electrical contacts.
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M3 - Conference contribution
AN - SCOPUS:84945899636
T3 - Advances in Powder Metallurgy and Particulate Materials - 2014, Proceedings of the 2014 World Congress on Powder Metallurgy and Particulate Materials, PM 2014
SP - 936
EP - 945
BT - Advances in Powder Metallurgy and Particulate Materials - 2014, Proceedings of the 2014 World Congress on Powder Metallurgy and Particulate Materials, PM 2014
PB - Metal Powder Industries Federation
T2 - 2014 World Congress on Powder Metallurgy and Particulate Materials, PM 2014
Y2 - 18 May 2014 through 22 May 2014
ER -