Keyphrases
Size Limit
100%
Flip chip
100%
Chip Size
100%
Solder Joint
75%
Chip-on-board
75%
Underfill
50%
CTE Mismatch
50%
Thermomechanical Reliability
50%
Process Conditions
25%
Operating Conditions
25%
Optimum Combination
25%
Order of Magnitude
25%
Material Properties
25%
Material Parameters
25%
Service Environment
25%
Structure Reliability
25%
Delamination
25%
Operating Parameters
25%
On chip
25%
Warpage
25%
Creep Strain
25%
Geometrical Parameters
25%
Organic Substrate
25%
Testing Conditions
25%
Mechanical Problems
25%
Thermal Expansion Mismatch
25%
Georgia Tech
25%
Board Structure
25%
Fundamental Limits
25%
Epoxy-based
25%
FEA Simulation
25%
Technical University
25%
Process-induced Defects
25%
Structural Compliance
25%
Underfill Material
25%
Engineering
Joints (Structural Components)
100%
Process Condition
20%
Limitations
20%
Material Parameter
20%
Constrains
20%
Interconnects
20%
Operating Parameter
20%
Creep Strain
20%
Geometrical Parameter
20%
Induced Defect
20%
Testing Condition
20%
Structural Reliability
20%
Fundamental Limit
20%
Delamination
20%