TY - GEN
T1 - Dynamic Distribution of Edge Intelligence at the Node Level for Internet of Things
AU - Mohammed, Hawzhin
AU - Odetola, Tolulope A.
AU - Guo, Nan
AU - Hasan, Syed Rafay
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021/8/9
Y1 - 2021/8/9
N2 - In this paper, dynamic deployment of Convolutional Neural Network (CNN) architecture is proposed utilizing only IoT-level devices. By partitioning and pipelining the CNN, it horizontally distributes the computation load among resource-constrained devices (called as horizontal collaboration), which in turn increases the throughput. Through partitioning, we can decrease the computation and energy consumption on individual IoT devices and increase the throughput without sacrificing accuracy. Also, by processing the data at the generation point, data privacy can be achieved. The results show that throughput can be increased by 1.55x to 1.75x for sharing the CNN into two and three resource-constrained devices, respectively.
AB - In this paper, dynamic deployment of Convolutional Neural Network (CNN) architecture is proposed utilizing only IoT-level devices. By partitioning and pipelining the CNN, it horizontally distributes the computation load among resource-constrained devices (called as horizontal collaboration), which in turn increases the throughput. Through partitioning, we can decrease the computation and energy consumption on individual IoT devices and increase the throughput without sacrificing accuracy. Also, by processing the data at the generation point, data privacy can be achieved. The results show that throughput can be increased by 1.55x to 1.75x for sharing the CNN into two and three resource-constrained devices, respectively.
UR - http://www.scopus.com/inward/record.url?scp=85115630653&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85115630653&partnerID=8YFLogxK
U2 - 10.1109/MWSCAS47672.2021.9531765
DO - 10.1109/MWSCAS47672.2021.9531765
M3 - Conference contribution
AN - SCOPUS:85115630653
T3 - Midwest Symposium on Circuits and Systems
SP - 330
EP - 333
BT - 2021 IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2021 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2021 IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2021
Y2 - 9 August 2021 through 11 August 2021
ER -