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Dynamic response of flexible hybrid electronic material systems
Nicholas C. Sears
, John Daniel Berrigan
, Philip R. Buskohl
, Ryan L. Harne
Mechanical Engineering
Research output
:
Contribution to journal
›
Article
›
peer-review
6
Scopus citations
Overview
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Keyphrases
Application Environment
14%
Conductive Ink
14%
Current Flow
14%
Cyclic Displacement
14%
Dynamic Applications
14%
Dynamic Response
100%
Electrical Current
14%
Electrical Network
14%
Electrical Resistance
14%
Electronic Materials
100%
Flexible Hybrid Electronics
100%
Functional Materials
14%
Heat Generation
14%
Heat-induced
14%
High-cycle
14%
Increased Temperature
14%
Large Strain
14%
Local Strain
14%
Material Architecture
14%
Material System
100%
Motion Monitoring
14%
Network Materials
14%
Pre-strain
42%
Resistance to Change
14%
Silver Microflakes
14%
Strain Rate
14%
Strain Response
14%
Thermal Heat
14%
Vibration Isolation
14%
Engineering
Conductive
14%
Conductive Ink
14%
Current Flow
14%
Cycle Frequency
14%
Dynamic Response
100%
Engineering
14%
Flexible Hybrid Electronics
100%
Future Application
14%
Heat Generation
14%
Local Strain
14%
Material System
100%
Mechanical Stress
14%
Phase Composition
14%
Prestrain
42%
Resistance Change
14%
Strain Rate
14%
Strain Response
14%
Vibration Isolation
14%
Material Science
Electrical Resistance
20%
Electronic Material
100%
Functional Material
20%
Mechanical Stress
20%
Phase Composition
20%
Silver
20%
Strain Rate
20%