Dynamic self-assembly and patterns in electrostatically driven granular media

M. V. Sapozhnikov; Y. V. Tolmachev; I. S. Aranson; W. K. Kwok

Dynamic self-assembly and patterns in electrostatically driven granular media

M. V. Sapozhnikov, Y. V. Tolmachev, I. S. Aranson, W. K. Kwok

Research output: Contribution to journal › Article › peer-review

Abstract

The discovery of a series of remarkably rich novel vortex phases and the dynamic assembly of electric field-driven conductive particles for poorly conductive fluids was reported. The results exemplify the importance of interactions between the particles and uncompensated ionic charges in the bulk of the liquid. Extension of the experiments toward self-assembly of submicron particles may have intriguing practical applications, such as lithographic patterning and assembly.

Original language	English (US)
Article number	114301
Pages (from-to)	114301/1-114301/4
Journal	Physical review letters
Volume	90
Issue number	11
State	Published - Mar 21 2003

All Science Journal Classification (ASJC) codes

General Physics and Astronomy

Cite this

@article{4e4dfac903eb4678b2cab7801162865d,

title = "Dynamic self-assembly and patterns in electrostatically driven granular media",

abstract = "The discovery of a series of remarkably rich novel vortex phases and the dynamic assembly of electric field-driven conductive particles for poorly conductive fluids was reported. The results exemplify the importance of interactions between the particles and uncompensated ionic charges in the bulk of the liquid. Extension of the experiments toward self-assembly of submicron particles may have intriguing practical applications, such as lithographic patterning and assembly.",

author = "Sapozhnikov, {M. V.} and Tolmachev, {Y. V.} and Aranson, {I. S.} and Kwok, {W. K.}",

note = "Funding Information: We are grateful to A. A. Abrikosov and V. M. Vinokur for fruitful discussions. This research was supported by the U.S. DOE, Grant No. W-31-109-ENG-38.",

year = "2003",

month = mar,

day = "21",

language = "English (US)",

volume = "90",

pages = "114301/1--114301/4",

journal = "Physical review letters",

issn = "0031-9007",

publisher = "American Physical Society",

number = "11",

}

TY - JOUR

T1 - Dynamic self-assembly and patterns in electrostatically driven granular media

AU - Sapozhnikov, M. V.

AU - Tolmachev, Y. V.

AU - Aranson, I. S.

AU - Kwok, W. K.

N1 - Funding Information: We are grateful to A. A. Abrikosov and V. M. Vinokur for fruitful discussions. This research was supported by the U.S. DOE, Grant No. W-31-109-ENG-38.

PY - 2003/3/21

Y1 - 2003/3/21

N2 - The discovery of a series of remarkably rich novel vortex phases and the dynamic assembly of electric field-driven conductive particles for poorly conductive fluids was reported. The results exemplify the importance of interactions between the particles and uncompensated ionic charges in the bulk of the liquid. Extension of the experiments toward self-assembly of submicron particles may have intriguing practical applications, such as lithographic patterning and assembly.

AB - The discovery of a series of remarkably rich novel vortex phases and the dynamic assembly of electric field-driven conductive particles for poorly conductive fluids was reported. The results exemplify the importance of interactions between the particles and uncompensated ionic charges in the bulk of the liquid. Extension of the experiments toward self-assembly of submicron particles may have intriguing practical applications, such as lithographic patterning and assembly.

UR - http://www.scopus.com/inward/record.url?scp=0038643248&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0038643248&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:0038643248

SN - 0031-9007

VL - 90

SP - 114301/1-114301/4

JO - Physical review letters

JF - Physical review letters

IS - 11

M1 - 114301

ER -

Dynamic self-assembly and patterns in electrostatically driven granular media

Abstract

All Science Journal Classification (ASJC) codes

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