Abstract
The microstructural development of a multilayer substrate during co-firing was investigated using a combination of Environmental Scanning Electron Microscopy and sinter/quenching experiments. The multilayer samples were composed of a low temperature co-fireable ceramic substrate with buried silver thick films. At low heating rates the film was found to delaminate from the substrate during initial stage sintering of the silver. This delamination was healed as soon as the film's glass frit softened and flowed to the substrate and no further damage occurred. For heating rates greater than 25°C/min delamination occurred above 800°C and was facilitated by porosity at the film/substrate interface. This porosity was due to residual gases from the binder burnout process.
| Original language | English (US) |
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| Pages | 643-650 |
| Number of pages | 8 |
| State | Published - 1994 |
| Event | Proceedings of the 1994 7th International SAMPE Electronics Conference - Parsippany, NJ, USA Duration: Jun 20 1994 → Jun 23 1994 |
Other
| Other | Proceedings of the 1994 7th International SAMPE Electronics Conference |
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| City | Parsippany, NJ, USA |
| Period | 6/20/94 → 6/23/94 |
All Science Journal Classification (ASJC) codes
- General Engineering