@inproceedings{3429ddbcf5e54932aa9b8f30c0994c63,
title = "Effect of droplet spacing & deposition height on Sn conductive lines by pneumatic diaphragm drop-on-demand technology",
abstract = "Pneumatic diaphragm drop-on-demand (DOD) Technology is an attractive method for Sn conductive lines owing to low-cost, low-waste, and simple process. Based on stable generation of Sn droplets, the process parameters such as droplet spacing and deposition height have significant effect on the final quality of Sn conductive lines. In this work, Sn conductive lines were generated while droplet spacing was between 0.5mm and 2.2mm and deposition height was between 20mm and 38mm. The result suggested that proper droplet spacing and small deposition height would get high quality Sn conductive lines.",
author = "Chunxi Wang and Daokun Liao and Sheng Liu and Xiaotian Li and Honghai Zhang",
note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 17th International Conference on Electronic Packaging Technology, ICEPT 2016 ; Conference date: 16-08-2016 Through 19-08-2016",
year = "2016",
month = oct,
day = "4",
doi = "10.1109/ICEPT.2016.7583410",
language = "English (US)",
series = "2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1512--1516",
editor = "Keyun Bi and Sheng Liu and Shengjun Zhou",
booktitle = "2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016",
address = "United States",
}