Effect of EBG structures for reducing noise in multi-layer PCBs for digital systems

Daehyun Chung; Tae Hong Kim; Chunghyun Ryu; Ege Engin; Madhavan Swaminathan; Joungho Kim

doi:10.1109/EPEP.2006.321242

Effect of EBG structures for reducing noise in multi-layer PCBs for digital systems

Daehyun Chung, Tae Hong Kim, Chunghyun Ryu, Ege Engin, Madhavan Swaminathan, Joungho Kim

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

8 Scopus citations

Abstract

The effect of EBG structures in various noise source environments is investigated. In this paper a one-dimensional electromagnetic band gap structure (1D-EBG) has been used in the power/ground planes for isolating signal vias from noise sources. The 1D-EBG structure generates about -70dB isolation in the path between the noise source and the signal via structure, so as to minimize the coupling of the power/ground cavity noise into the signal lines. In the presence of EBG structures, the voltage noise and timing jitter are significantly reduced for periodic noise sources. However, for random noise sources, the voltage noise and timing jitter can increase in the presence of EBG structures. This paper quantifies this effect.

Original language	English (US)
Title of host publication	Electrical Performance of Electronic Packaging, EPEP
Pages	253-256
Number of pages	4
DOIs	https://doi.org/10.1109/EPEP.2006.321242
State	Published - 2006
Event	14th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP - Scottsdale, AZ, United States Duration: Oct 23 2006 → Oct 25 2006

Publication series

Name	Electrical Performance of Electronic Packaging, EPEP

Conference

Conference	14th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP
Country/Territory	United States
City	Scottsdale, AZ
Period	10/23/06 → 10/25/06

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering

Access to Document

10.1109/EPEP.2006.321242

Cite this

@inproceedings{7adfa7a14c42450a926e8b4025c20e86,

title = "Effect of EBG structures for reducing noise in multi-layer PCBs for digital systems",

abstract = "The effect of EBG structures in various noise source environments is investigated. In this paper a one-dimensional electromagnetic band gap structure (1D-EBG) has been used in the power/ground planes for isolating signal vias from noise sources. The 1D-EBG structure generates about -70dB isolation in the path between the noise source and the signal via structure, so as to minimize the coupling of the power/ground cavity noise into the signal lines. In the presence of EBG structures, the voltage noise and timing jitter are significantly reduced for periodic noise sources. However, for random noise sources, the voltage noise and timing jitter can increase in the presence of EBG structures. This paper quantifies this effect.",

author = "Daehyun Chung and Kim, {Tae Hong} and Chunghyun Ryu and Ege Engin and Madhavan Swaminathan and Joungho Kim",

year = "2006",

doi = "10.1109/EPEP.2006.321242",

language = "English (US)",

isbn = "1424406684",

series = "Electrical Performance of Electronic Packaging, EPEP",

pages = "253--256",

booktitle = "Electrical Performance of Electronic Packaging, EPEP",

note = "14th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP ; Conference date: 23-10-2006 Through 25-10-2006",

}

Chung, D, Kim, TH, Ryu, C, Engin, E, Swaminathan, M & Kim, J 2006, Effect of EBG structures for reducing noise in multi-layer PCBs for digital systems. in Electrical Performance of Electronic Packaging, EPEP., 4115402, Electrical Performance of Electronic Packaging, EPEP, pp. 253-256, 14th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP, Scottsdale, AZ, United States, 10/23/06. https://doi.org/10.1109/EPEP.2006.321242

TY - GEN

T1 - Effect of EBG structures for reducing noise in multi-layer PCBs for digital systems

AU - Chung, Daehyun

AU - Kim, Tae Hong

AU - Ryu, Chunghyun

AU - Engin, Ege

AU - Swaminathan, Madhavan

AU - Kim, Joungho

PY - 2006

Y1 - 2006

N2 - The effect of EBG structures in various noise source environments is investigated. In this paper a one-dimensional electromagnetic band gap structure (1D-EBG) has been used in the power/ground planes for isolating signal vias from noise sources. The 1D-EBG structure generates about -70dB isolation in the path between the noise source and the signal via structure, so as to minimize the coupling of the power/ground cavity noise into the signal lines. In the presence of EBG structures, the voltage noise and timing jitter are significantly reduced for periodic noise sources. However, for random noise sources, the voltage noise and timing jitter can increase in the presence of EBG structures. This paper quantifies this effect.

AB - The effect of EBG structures in various noise source environments is investigated. In this paper a one-dimensional electromagnetic band gap structure (1D-EBG) has been used in the power/ground planes for isolating signal vias from noise sources. The 1D-EBG structure generates about -70dB isolation in the path between the noise source and the signal via structure, so as to minimize the coupling of the power/ground cavity noise into the signal lines. In the presence of EBG structures, the voltage noise and timing jitter are significantly reduced for periodic noise sources. However, for random noise sources, the voltage noise and timing jitter can increase in the presence of EBG structures. This paper quantifies this effect.

UR - http://www.scopus.com/inward/record.url?scp=47749151372&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=47749151372&partnerID=8YFLogxK

U2 - 10.1109/EPEP.2006.321242

DO - 10.1109/EPEP.2006.321242

M3 - Conference contribution

AN - SCOPUS:47749151372

SN - 1424406684

SN - 9781424406685

T3 - Electrical Performance of Electronic Packaging, EPEP

SP - 253

EP - 256

BT - Electrical Performance of Electronic Packaging, EPEP

T2 - 14th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP

Y2 - 23 October 2006 through 25 October 2006

ER -

Effect of EBG structures for reducing noise in multi-layer PCBs for digital systems

Abstract

Publication series

Conference

All Science Journal Classification (ASJC) codes

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