Abstract
W-Cu composites are most commonly used as electrical contacts and thermal management devices. In the W-Cu systems a large wetting angle of liquid copper, a high dihedral angle and almost negligible solubility between tungsten and copper make it difficult in achieving high density because densification during liquid phase sintering of W-Cu is limited to rearrangement of the W particles and solid-state sintering of the W skeleton. However, one of the methods of increasing densification is by employing Cu-coating on W powder which increases rearrangement leading to higher densification. This study examines the effect of heating mode (conventional and microwave) and temperature on the sinterability of specially prepared commercial W-15Cu (by weight) powder of approximately 2 μm particle size , supplied by Osram Sylvania, Towanda, USA. The densification behavior and properties of the samples sintered by two methods have been studied and compared.
| Original language | English (US) |
|---|---|
| Title of host publication | Proceedings of the 7th International Conference on Tungsten, Refractory and Hardmaterials |
| Pages | 3134-3143 |
| Number of pages | 10 |
| State | Published - 2008 |
| Event | 7th International Conference on Tungsten, Refractory and Hardmaterials 2008 - Washington, DC, United States Duration: Jun 8 2008 → Jun 12 2008 |
Other
| Other | 7th International Conference on Tungsten, Refractory and Hardmaterials 2008 |
|---|---|
| Country/Territory | United States |
| City | Washington, DC |
| Period | 6/8/08 → 6/12/08 |
All Science Journal Classification (ASJC) codes
- Metals and Alloys
- Surfaces and Interfaces