TY - JOUR
T1 - Effect of processing defects on stress-strain-Ic for AgMg sheathed Bi-2212 tapes
AU - Mbaruku, A. L.
AU - Marken, K. R.
AU - Meinesz, M.
AU - Miao, H.
AU - Sastry, P. V.P.S.S.
AU - Schwartz, J.
N1 - Funding Information:
Manuscript received August 5, 2002. This work was supported by the National Science Foundation through the National High Magnetic Field Laboratory and the Office of Naval Research through the Center for Advanced Power Systems.
PY - 2003/6
Y1 - 2003/6
N2 - Manufacture of multifilamentary BSCCO tapes involves rolling of billets to final form. In BSCCO-2212 tapes, one method used to control the microstructure and increase Jc is intermediate annealing during the deformation process. At times, small bubbles have been observed on the tapes after annealing. Although such bubbles do not remain at the end of fabrication, the question of possible effect on superconducting performance has been studied. The sections that had bubbles after annealing were marked and the fabrication process completed on the tape. After final reaction of the tape, comparisons of stress-strain-Ic for bubbled and nonbubbled sections were performed. Here we present electrical, mechanical and microstructural studies on bubbled and bubble-free sections of tape. It was found that sections with bubbles had lower Ic than sections with no bubbles, though both had similar onset of Ic degradation at ∼ 0.40%.
AB - Manufacture of multifilamentary BSCCO tapes involves rolling of billets to final form. In BSCCO-2212 tapes, one method used to control the microstructure and increase Jc is intermediate annealing during the deformation process. At times, small bubbles have been observed on the tapes after annealing. Although such bubbles do not remain at the end of fabrication, the question of possible effect on superconducting performance has been studied. The sections that had bubbles after annealing were marked and the fabrication process completed on the tape. After final reaction of the tape, comparisons of stress-strain-Ic for bubbled and nonbubbled sections were performed. Here we present electrical, mechanical and microstructural studies on bubbled and bubble-free sections of tape. It was found that sections with bubbles had lower Ic than sections with no bubbles, though both had similar onset of Ic degradation at ∼ 0.40%.
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U2 - 10.1109/TASC.2003.812386
DO - 10.1109/TASC.2003.812386
M3 - Conference article
AN - SCOPUS:0041974634
SN - 1051-8223
VL - 13
SP - 3522
EP - 3525
JO - IEEE Transactions on Applied Superconductivity
JF - IEEE Transactions on Applied Superconductivity
IS - 2 III
T2 - 2002 Applied Superconductivity Conference
Y2 - 4 August 2002 through 9 August 2002
ER -