Effect of solidification conditions on partial melt processed Bi2212/Ag round wire

W. T. Nachtrab; X. T. Liu; T. Wong; J. Schwartz

doi:10.1109/TASC.2010.2099194

Effect of solidification conditions on partial melt processed Bi2212/Ag round wire

W. T. Nachtrab
, X. T. Liu
, T. Wong
, J. Schwartz

Research output: Contribution to journal › Article › peer-review

13 Scopus citations

Abstract

In this study, we report the effect of cooling from the peak temperature reached during partial melt processing on the critical current for a Bi2212/Ag wire. A single-stage cooling approach is compared to two-stage cooling. For two-stage cooling, the first stage cooling rate and the cooling rate transition temperature were varied to investigate the effects of undercooling on the solidification behavior of the 2212 phase. Two-stage cooling results in higher I_c compared to single-stage cooling, and the cooling rate transition temperature was found to have a greater effect on I_c than the initial cooling rate.

Original language	English (US)
Article number	5696776
Pages (from-to)	2795-2799
Number of pages	5
Journal	IEEE Transactions on Applied Superconductivity
Volume	21
Issue number	3 PART 3
DOIs	https://doi.org/10.1109/TASC.2010.2099194
State	Published - Jun 2011

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering

Access to Document

10.1109/TASC.2010.2099194

Cite this

@article{c930df447a8a4bad8476c9b9ab39520a,

title = "Effect of solidification conditions on partial melt processed Bi2212/Ag round wire",

abstract = "In this study, we report the effect of cooling from the peak temperature reached during partial melt processing on the critical current for a Bi2212/Ag wire. A single-stage cooling approach is compared to two-stage cooling. For two-stage cooling, the first stage cooling rate and the cooling rate transition temperature were varied to investigate the effects of undercooling on the solidification behavior of the 2212 phase. Two-stage cooling results in higher Ic compared to single-stage cooling, and the cooling rate transition temperature was found to have a greater effect on Ic than the initial cooling rate.",

author = "Nachtrab, \{W. T.\} and Liu, \{X. T.\} and T. Wong and J. Schwartz",

year = "2011",

month = jun,

doi = "10.1109/TASC.2010.2099194",

language = "English (US)",

volume = "21",

pages = "2795--2799",

journal = "IEEE Transactions on Applied Superconductivity",

issn = "1051-8223",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "3 PART 3",

}

TY - JOUR

T1 - Effect of solidification conditions on partial melt processed Bi2212/Ag round wire

AU - Nachtrab, W. T.

AU - Liu, X. T.

AU - Wong, T.

AU - Schwartz, J.

PY - 2011/6

Y1 - 2011/6

N2 - In this study, we report the effect of cooling from the peak temperature reached during partial melt processing on the critical current for a Bi2212/Ag wire. A single-stage cooling approach is compared to two-stage cooling. For two-stage cooling, the first stage cooling rate and the cooling rate transition temperature were varied to investigate the effects of undercooling on the solidification behavior of the 2212 phase. Two-stage cooling results in higher Ic compared to single-stage cooling, and the cooling rate transition temperature was found to have a greater effect on Ic than the initial cooling rate.

AB - In this study, we report the effect of cooling from the peak temperature reached during partial melt processing on the critical current for a Bi2212/Ag wire. A single-stage cooling approach is compared to two-stage cooling. For two-stage cooling, the first stage cooling rate and the cooling rate transition temperature were varied to investigate the effects of undercooling on the solidification behavior of the 2212 phase. Two-stage cooling results in higher Ic compared to single-stage cooling, and the cooling rate transition temperature was found to have a greater effect on Ic than the initial cooling rate.

UR - https://www.scopus.com/pages/publications/79957934860

UR - https://www.scopus.com/pages/publications/79957934860#tab=citedBy

U2 - 10.1109/TASC.2010.2099194

DO - 10.1109/TASC.2010.2099194

M3 - Article

AN - SCOPUS:79957934860

SN - 1051-8223

VL - 21

SP - 2795

EP - 2799

JO - IEEE Transactions on Applied Superconductivity

JF - IEEE Transactions on Applied Superconductivity

IS - 3 PART 3

M1 - 5696776

ER -

Effect of solidification conditions on partial melt processed Bi2212/Ag round wire

Abstract

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Fingerprint

Cite this